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Title:
ULTRASONIC SENSOR
Document Type and Number:
WIPO Patent Application WO/2019/051921
Kind Code:
A1
Abstract:
Disclosed is an ultrasonic sensor, comprising a shell (1) and a piezoelectric wafer (2) placed in the shell (1), wherein a base (3) is mounted at one end of the shell (1); and a flexible adhesive (5) is fixed at one side, facing the base (3), of the piezoelectric wafer (2), and a matching layer (4) is fixed at the other side thereof. The stirred pasty matching layer (4) is fixed on the piezoelectric wafer (2) by means of an adhesive dispensing or cementing method and is seamlessly adhered to the surface thereof, and the material of the matching layer (4) is then fully cured by means of heating, so that the matching layer (4) and the piezoelectric wafer (2) become a whole. The method for adhering the matching layer (4) to the piezoelectric wafer (2) to become a whole improves the echo sensitivity, significantly reduces the residual vibration and reduces a blind area of measurement. The ultrasonic sensor has a simple structure, is low in cost and has significantly improved performance.

Inventors:
XIAO JIANHU (CN)
LI YONGYUE (CN)
Application Number:
PCT/CN2017/106970
Publication Date:
March 21, 2019
Filing Date:
October 20, 2017
Export Citation:
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Assignee:
SUZHOU ETRON ELECTRONICS COMPONENTS CO LTD (CN)
International Classes:
G01D5/48
Foreign References:
CN201408266Y2010-02-17
CN202171478U2012-03-21
CN103743423A2014-04-23
CN102873018A2013-01-16
CN102288782A2011-12-21
CN103230866A2013-08-07
CN201611266U2010-10-20
CN201692927U2011-01-05
US20030189391A12003-10-09
US20110303013A12011-12-15
Attorney, Agent or Firm:
SUZHOU CREATOR PATENT AND TRADEMARK AGENCY LTD. (CN)
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