Title:
ULTRASONIC TRANSDUCER MODULE, ULTRASONIC ENDOSCOPE, AND METHOD FOR MANUFACTURING ULTRASONIC TRANSDUCER MODULE
Document Type and Number:
WIPO Patent Application WO/2017/199861
Kind Code:
A1
Abstract:
This ultrasonic transducer module is provided with the following: a plurality of piezoelectric elements that are configured by being aligned in the lengthwise direction; electrodes formed on the surfaces of the piezoelectric elements; and a wiring material having recesses formed at junction portions that join to the electrodes. According to the present invention, even with a narrower pitch, junction strength between the piezoelectric elements and the wiring can be ensured.
Inventors:
WAKABAYASHI KATSUHIRO (JP)
Application Number:
PCT/JP2017/017940
Publication Date:
November 23, 2017
Filing Date:
May 11, 2017
Export Citation:
Assignee:
OLYMPUS CORP (JP)
International Classes:
A61B8/12
Foreign References:
| JPH1156857A | 1999-03-02 | |||
| JPH06177533A | 1994-06-24 | |||
| JP2002246721A | 2002-08-30 | |||
| JPH10223822A | 1998-08-21 |
Other References:
See also references of EP 3459465A4
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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