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Patent Searching and Data


Title:
ULTRASONIC WAVE INSPECTION DEVICE, ULTRASONIC INSPECTION METHOD, AND PROGRAM
Document Type and Number:
WIPO Patent Application WO/2022/173062
Kind Code:
A1
Abstract:
In order to suppress a reduction in convenience without using an S gate for which a suitable setting is difficult and enable a desired clear image of a joining interface to be generated, provided is an ultrasonic wave inspection device comprising an ultrasonic wave probe and a controller, wherein the controller: (A) defines, on the basis of a received prescribed condition, a first gate that indicates a time range in which a portion of a reflection wave is extracted; (B) defines one or more second gates that indicate a time width smaller than that of the first gate before the ending time of the first gate; (C) with respect to each of a plurality of measurement points of a subject, (C1) detects a lower layer echo or a local peak reflected from the interface of layers lower than the top surface of the subject from a reflection wave corresponding to the measurement point, and (C2) adjusts a reception time of the reflection wave on the basis of the lower layer echo or the local peak; and (D) generates a sectional image of the subject on the basis of the second gate and the reflection wave after the time adjustment.

Inventors:
SAKAI KAORU (JP)
KOBAYASHI MASAYUKI (JP)
SUGAYA NATSUKI (JP)
KIKUKAWA KOTARO (JP)
Application Number:
PCT/JP2022/008093
Publication Date:
August 18, 2022
Filing Date:
February 25, 2022
Export Citation:
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Assignee:
HITACHI POWER SOLUTIONS CO LTD (JP)
International Classes:
G01N29/06; G01N29/38
Foreign References:
JP2003121426A2003-04-23
JP2017129444A2017-07-27
JP2020091194A2020-06-11
JP2009175136A2009-08-06
US5629865A1997-05-13
Attorney, Agent or Firm:
ISONO INTERNATIONAL PATENT OFFICE, P.C. (JP)
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