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Patent Searching and Data


Title:
ULTRASOUND PROBE
Document Type and Number:
WIPO Patent Application WO/2017/006590
Kind Code:
A1
Abstract:
Disclosed is an ultrasound probe wherein a backing having built-in lead arrays is disposed on the rear surface side of a plurality of vibrating elements, and backing terminal arrays connected to the lead arrays are provided on the lower surface of the backing. A relay substrate is provided between the backing and an electronic substrate. The relay substrate is provided with electrode section arrays corresponding to the backing terminal arrays. An electrode section includes: a substrate terminal connected to a backing terminal; a via for substrate internal wiring, said via being formed at a position shifted from the substrate terminal; and a conducting path that connects the substrate terminal and the via to each other. The electrode section arrays include a transmission electrode section array, and a reception electrode section array. The shift direction of the transmission electrode section array and that of the reception electrode section array are different from each other.

Inventors:
SHIRAISHI Tomohiro (6-22-1, Mure, Mitaka-sh, Tokyo 22, 〒1818622, JP)
Application Number:
JP2016/057825
Publication Date:
January 12, 2017
Filing Date:
March 11, 2016
Export Citation:
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Assignee:
HITACHI, LTD. (6-6 Marunouchi 1-chome, Chiyoda-ku Tokyo, 80, 〒1008280, JP)
International Classes:
A61B8/06; H04R17/00
Foreign References:
JP2006020297A2006-01-19
JP2002345094A2002-11-29
JPH10512680A1998-12-02
JPH09238939A1997-09-16
JPS63234953A1988-09-30
Attorney, Agent or Firm:
YKI PATENT ATTORNEYS (1-34-12, Kichijoji-Honcho Musashino-sh, Tokyo 04, 〒1800004, JP)
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