Title:
ULTRATHIN COPPER FOIL WITH CARRIER, COPPER-CLAD LAMINATE, AND CORELESS SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2014/132947
Kind Code:
A1
Abstract:
A carrier foil, an ultrathin copper foil, and an ultrathin copper foil with a carrier in which a separation layer is formed between the carrier foil and the ultrathin copper foil, wherein the invention is characterized in that the separation layer is formed under plating conditions such that the proportion in which a metal (B) is deposited is higher than the proportion in which a metal (A) is deposited, the separation layer comprising a first separation layer formed on the carrier foil side, and a second separation layer formed on the ultrathin copper foil side. The first separation layer comprises a metal (A) for retaining detachability, and a metal (B) for facilitating plating of the ultrathin copper foil. The ratio (x1) of elements of metal (A) and the ratio (y1) of elements of metal (B) satisfy the equation 70(%)<{y1/(x1+y1)}×100≤79(%). The second separation layer comprises a metal (A) for retaining detachability, and a metal (B) for facilitating plating of the ultrathin copper foil. The ratio (x2) of elements of metal (A) and the ratio (y2) of elements of metal (B) satisfy the equation 80(%)<{y2/(x2+y2)}×100≤88(%).
Inventors:
FUJITA RYOTA (JP)
UNO TAKEO (JP)
UNO TAKEO (JP)
Application Number:
PCT/JP2014/054457
Publication Date:
September 04, 2014
Filing Date:
February 25, 2014
Export Citation:
Assignee:
FURUKAWA ELECTRIC CO LTD (JP)
International Classes:
C25D1/04; C25D7/06; H05K1/09
Domestic Patent References:
| WO2010027052A1 | 2010-03-11 | |||
| WO2006013735A1 | 2006-02-09 | |||
| WO2012133638A1 | 2012-10-04 |
Foreign References:
| JP2012102407A | 2012-05-31 | |||
| JP2007186781A | 2007-07-26 | |||
| JP2007186782A | 2007-07-26 | |||
| JP2012246567A | 2012-12-13 | |||
| JP2004535515A | 2004-11-25 | |||
| JP2009272589A | 2009-11-19 |
Attorney, Agent or Firm:
SATOH, TAKAHISA (JP)
Takahisa Sato (JP)
Takahisa Sato (JP)
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