ULTRAVIOLET-CURABLE HEAT-DISSIPATING RESIN COMPOSITION, HEAT-DISSIPATING PRESSURE-SENSITIVE ADHESIVE SHEET, LAYERED PRODUCT, AND METHOD FOR PRODUCING LAYERED PRODUCT

WIPO Patent Application WO/2022/255317

A1

A purpose of the present invention is to provide an ultraviolet-curable heat-dissipating resin composition excellent in terms of printability, heat-dissipating property, and adhesiveness to various substrates. Another purpose is to provide a heat-dissipating pressure-sensitive adhesive sheet obtained using the ultraviolet-curable heat-dissipating resin composition, a layered product, and a method for producing the layered product. This ultraviolet-curable heat-dissipating resin composition comprises (A) a nitrogen-containing monomer, (B) a monofunctional (meth)acrylate monomer, (C) a crosslinking component, (D) a photopolymerization initiator, and (E) a thermally conductive filler having a thermal conductivity of 3 W/m·K or greater, wherein the content of the thermally conductive filler (E) is 20-70 vol% and the content of the nitrogen-containing monomer (A) is 10-35 wt% with respect to the composition excluding the thermally conductive filler (E).

OKUHARA CHIHARU (JP)
NEMOTO KAITO (JP)
KAWADA SHINJI (JP)
KAGE SHUUJI (JP)
TODA TOMOKI (JP)

PCT/JP2022/021984

December 08, 2022

May 30, 2022

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SEKISUI CHEMICAL CO LTD (JP)

C08F2/44; B05D3/06; B05D7/24; B32B27/00; B32B27/16; B32B27/30; C09J4/02; C09J7/38; C09J11/04; C09J11/08

WO2012108289A1	2012-08-16
WO2012063935A1	2012-05-18

JP2002155110A	2002-05-28
JP2014074132A	2014-04-24
JP2006316175A	2006-11-24

WISEPLUS IP FIRM (JP)

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