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Title:
ULTRAVIOLET-CURABLE RESIN COMPOSITION AND PHOTOSOLDER RESIST INK CONTAINING THE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2002/048226
Kind Code:
A1
Abstract:
An ultraviolet-curable resin composition which is excellent in developped-line width and resolution and satisfactory in soldering heat resistance and gold plating resistance. The resin composition comprises (A) an ultraviolet-curable resin obtained by polymerizing an ethylenic monomer ingredient comprising an epoxidized ethylenic monomer (i), reacting the resultant epoxidized polmymer (a) with a carboxylated ethylenic monomer (b), and reacting the resultant intermediate with an (un)saturated polybasic acid anhydride (c); (B) an epoxy compound having two or more epoxy groups per molecule; (C) a photopolymerization initiator; (D) a diluent; and (E) an ultraviolet-curable resin which is obtained by reacting a novolak epoxy compound (e) with a carboxylated ethylenic monomer (b) and reacting the resultant intermediate with an (un)saturated polybasic acid anhydride (c) and which has an acid value of 10 to 45 mgKOH/g, excluding 45 mgKOH/g.

Inventors:
Hashimoto, Soichi c/o Goo Chemical Co. (Ltd. 58 Ijir, Iseda-cho Uji-shi Kyoto, 611-0043, JP)
Application Number:
PCT/JP2001/010657
Publication Date:
June 20, 2002
Filing Date:
December 06, 2001
Export Citation:
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Assignee:
GOO CHEMICAL CO., LTD. (58 Ijiri, Iseda-cho Uji-shi, Kyoto, 611-0043, JP)
Hashimoto, Soichi c/o Goo Chemical Co. (Ltd. 58 Ijir, Iseda-cho Uji-shi Kyoto, 611-0043, JP)
International Classes:
C08F8/08; C08F283/06; C08F290/12; C08F290/14; C08F299/00; C08F299/02; C08G59/14; C08G59/42; C08L63/10; G03F7/038; H05K3/28; (IPC1-7): C08F299/02; C08G59/14; H05K3/28; C09D11/00; G03F7/027
Foreign References:
JPH0750473A1995-02-21
US4948700A1990-08-14
JPH04166944A1992-06-12
JPH04151158A1992-05-25
Other References:
See also references of EP 1359172A4
Attorney, Agent or Firm:
Nishikawa, Yoshikiyo (Hokuto Patent Attorneys Office Umeda-Daiichiseimei Bldg. 5F 12-17, Umeda 1-chome Kita-ku Osaka-shi, Osaka, 530-0001, JP)
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