ULTRAVIOLET-CURABLE RESIN COMPOSITION AND PHOTOSOLDER RESIST INK CONTAINING THE COMPOSITION

Title:

ULTRAVIOLET-CURABLE RESIN COMPOSITION AND PHOTOSOLDER RESIST INK CONTAINING THE COMPOSITION

Document Type and Number:

WIPO Patent Application WO/2002/048226

Kind Code:

A1

Abstract:

An ultraviolet-curable resin composition which is excellent in developped-line width and resolution and satisfactory in soldering heat resistance and gold plating resistance. The resin composition comprises (A) an ultraviolet-curable resin obtained by polymerizing an ethylenic monomer ingredient comprising an epoxidized ethylenic monomer (i), reacting the resultant epoxidized polmymer (a) with a carboxylated ethylenic monomer (b), and reacting the resultant intermediate with an (un)saturated polybasic acid anhydride (c); (B) an epoxy compound having two or more epoxy groups per molecule; (C) a photopolymerization initiator; (D) a diluent; and (E) an ultraviolet-curable resin which is obtained by reacting a novolak epoxy compound (e) with a carboxylated ethylenic monomer (b) and reacting the resultant intermediate with an (un)saturated polybasic acid anhydride (c) and which has an acid value of 10 to 45 mgKOH/g, excluding 45 mgKOH/g.

Inventors:

HASHIMOTO SOICHI (JP)

Application Number:

PCT/JP2001/010657

Publication Date:

June 20, 2002

Filing Date:

December 06, 2001

Export Citation:

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Assignee:

GOO CHEMICAL CO LTD (JP)
HASHIMOTO SOICHI (JP)

International Classes:

C08F8/08; C08F283/06; C08F290/12; C08F290/14; C08F299/00; C08F299/02; C08G59/14; C08G59/42; C08L63/10; G03F7/038; H05K3/28; (IPC1-7): C08F299/02; C08G59/14; C09D11/00; G03F7/027; H05K3/28

Foreign References:

JPH0750473A	1995-02-21
US4948700A	1990-08-14
JPH04166944A	1992-06-12
JPH04151158A	1992-05-25

Other References: