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Title:
UNDERFILL COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2013/035869
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a composition for which problems do not arise during work even when heated, in a mounting step for an electronic device. This invention pertains to an underfill composition including a (meth) acrylic compound (a) and an isocyanuric acid (c) having an aryl group.

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JP4131681Manufacturing method of semiconductor devices
Inventors:
HORIGUCHI YUSUKE (JP)
SANO MIEKO (JP)
SATO KENICHIRO (JP)
Application Number:
PCT/JP2012/072985
Publication Date:
March 14, 2013
Filing Date:
September 07, 2012
Export Citation:
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Assignee:
HENKEL AG & CO KGAA (DE)
HORIGUCHI YUSUKE (JP)
SANO MIEKO (JP)
SATO KENICHIRO (JP)
International Classes:
H01L21/60; C08F220/10; C08F222/40; C08F226/06; H01L23/29; H01L23/31
Foreign References:
JP2001302736A2001-10-31
JP2008081713A2008-04-10
JPH04202514A1992-07-23
JP2010226098A2010-10-07
JPH08213517A1996-08-20
US5973166A1999-10-26
Other References:
See also references of EP 2755233A4
Attorney, Agent or Firm:
ITO, Katsuhiro et al. (JP)
Katsuhiro Ito (JP)
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