Title:
UNDERLAYER FILM FORMING COMPOSITION FOR IMPRINTING, CURABLE COMPOSITION FOR IMPRINTING, AND KIT
Document Type and Number:
WIPO Patent Application WO/2019/172156
Kind Code:
A1
Abstract:
An underlayer film forming composition for imprinting, which contains a polymer and a solvent, and which is configured such that if this underlayer film forming composition is formed into a film and baked at 80°C, a specific compound that has a molecular weight of 210 or more is separated from the polymer. The present invention also relates to: a curable composition for imprinting, which is relevant to this underlayer film forming composition for imprinting; and a kit which uses this underlayer film forming composition for imprinting or this curable composition for imprinting.
Inventors:
SHIMOJU NAOYA (JP)
GOTO YUICHIRO (JP)
HAKAMATA AKIHIRO (JP)
GOTO YUICHIRO (JP)
HAKAMATA AKIHIRO (JP)
Application Number:
PCT/JP2019/008277
Publication Date:
September 12, 2019
Filing Date:
March 04, 2019
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
H01L21/027; B32B27/30; C08F20/10
Domestic Patent References:
| WO2013191228A1 | 2013-12-27 | |||
| WO2011118797A1 | 2011-09-29 | |||
| WO2014157226A1 | 2014-10-02 | |||
| WO2016152600A1 | 2016-09-29 | |||
| WO2016148095A1 | 2016-09-22 | |||
| WO2014208542A1 | 2014-12-31 |
Foreign References:
| JP2017039809A | 2017-02-23 | |||
| JP2010526426A | 2010-07-29 | |||
| JP2009503139A | 2009-01-29 | |||
| JP2016141797A | 2016-08-08 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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