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Patent Searching and Data


Title:
UNDERLAYER FILM FORMING COMPOSITION FOR IMPRINTING AND PRACTICAL APPLICATION THEREOF
Document Type and Number:
WIPO Patent Application WO/2019/188881
Kind Code:
A1
Abstract:
An underlayer film forming composition for imprinting, the composition containing a polymer and a solvent, and the polymer containing a monomer-derived constituent unit having a pKa of 4.0 or less, and a polymerizable group. The present invention also pertains to a kit related to this underlayer film forming composition for imprinting, a curable composition for imprinting, a laminate, a method for manufacturing a laminate, a pattern formation method, and a method for manufacturing a semiconductor device.

Inventors:
HAKAMATA AKIHIRO (JP)
GOTO YUICHIRO (JP)
SHIMOJU NAOYA (JP)
Application Number:
JP2019/012322
Publication Date:
October 03, 2019
Filing Date:
March 25, 2019
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
H01L21/027; B05D1/36; B05D3/06; B05D3/12; B29C35/08; B29C59/02; B32B27/00; B41M5/00; C09D5/00; C09D133/14; C09D201/00
Domestic Patent References:
WO2015194507A12015-12-23
WO2011013630A12011-02-03
Foreign References:
JP2014192178A2014-10-06
JP2014093385A2014-05-19
JP2010526426A2010-07-29
Attorney, Agent or Firm:
SIKS & CO. (JP)
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