Title:
UNDERLAYER-FILM-FORMING COMPOSITION FOR IMPRINTING, METHOD FOR PRODUCING UNDERLAYER-FILM-FORMING COMPOSITION, KIT, METHOD FOR PRODUCING PATTERN, AND METHOD FOR PRODUCING SEMICONDUCTOR ELEMENT
Document Type and Number:
WIPO Patent Application WO/2020/184497
Kind Code:
A1
Abstract:
An underlayer-film-forming composition for imprinting which comprises a polymer having a polymerizable group, a chelating agent, and a solvent; a method for producing the underlayer-film-forming composition; a kit including the underlayer-film-forming composition; a method for producing a pattern using the underlayer-film-forming composition; and a method for producing a semiconductor element, the method including, as a step, the method for producing a pattern.
Inventors:
HAKAMATA AKIHIRO (JP)
GOTO YUICHIRO (JP)
SHIMOJU NAOYA (JP)
GOTO YUICHIRO (JP)
SHIMOJU NAOYA (JP)
Application Number:
PCT/JP2020/009901
Publication Date:
September 17, 2020
Filing Date:
March 09, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F290/08; B29C59/02; C08F299/00; C08K5/09; C08L101/00; H01L21/027
Domestic Patent References:
| WO2016152600A1 | 2016-09-29 | |||
| WO2013145829A1 | 2013-10-03 | |||
| WO2011013630A1 | 2011-02-03 | |||
| WO2014157228A1 | 2014-10-02 |
Foreign References:
| JP2000128783A | 2000-05-09 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
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