Title:
UNSATURATED GROUP-CONTAINING ALKALI DEVELOPABLE RESIN AND RESIN MATERIAL FOR SOLDER RESISTS
Document Type and Number:
WIPO Patent Application WO/2016/136455
Kind Code:
A1
Abstract:
To provide: an unsaturated group-containing alkali developable resin which has excellent developability and provides a cured product having excellent heat resistance and dielectric characteristics; a photocurable alkali developable resin composition which contains this unsaturated group-containing alkali developable resin; a cured product of this photocurable alkali developable resin composition; a resin material for solder resists; and a resist member. An unsaturated group-containing alkali developable resin which has a molecular structure obtained by reacting, as essential starting materials, (A) a polyepoxy compound, (B) an unsaturated monocarboxylic acid, (C) an unsaturated monocarboxylic acid anhydride and (D) a dicarboxylic acid anhydride, and which has an acid value within the range of 50-80 mgKOH/g and a hydroxyl number of 19 mgKOH/g or less.
Inventors:
YAMADA SHUNSUKE (JP)
ASANO YU (JP)
KAMEYAMA HIROFUMI (JP)
ASANO YU (JP)
KAMEYAMA HIROFUMI (JP)
Application Number:
PCT/JP2016/053771
Publication Date:
September 01, 2016
Filing Date:
February 09, 2016
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08F299/00; C08G59/16; G03F7/027
Foreign References:
| JPH0987346A | 1997-03-31 | |||
| JPH08259663A | 1996-10-08 | |||
| JP2011144230A | 2011-07-28 | |||
| JP2010248308A | 2010-11-04 | |||
| JP2009096758A | 2009-05-07 | |||
| JP2008038029A | 2008-02-21 | |||
| US6515166B1 | 2003-02-04 |
Attorney, Agent or Firm:
KONO MICHIHIRO (JP)
Michihiro Kono (JP)
Michihiro Kono (JP)
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