UPPER MOLD FOR MLCC LAMINATION - 21TH CENTURY CO LTD

Title:

UPPER MOLD FOR MLCC LAMINATION

Document Type and Number:

WIPO Patent Application WO/2018/135740

Kind Code:

A1

Abstract:

The present invention relates to an upper mold for MLCC lamination configured such that ultra-thin film sheets for MLCC fabrication are uniformly laminated into a lamination array, the upper mold for MLCC lamination comprising: a vacuum head comprising a first area formed by a plurality of base holes, which communicate with an air channel formed on the upper surface, and by through-holes that connect the lower surface and respective base holes so as to communicate with each other such that air flows between the base holes and the lower surface, the first area having a predetermined area, and the vacuum head comprising a second area configured by a plurality of adhesion holes formed adjacent to the periphery of the first area as at least one pair facing each other, thereby suctioning air; a mesh plate fixed to the lower surface of the vacuum head so as to have a size corresponding to that of the first area, the mesh plate having a porous structure such that, when air flows through the through-holes of the first area, suction and discharge can occur evenly; and a contact plate fixed to the lower surface of the vacuum head by adhesion of the second area while contacting with the mesh plate such that the thin-film sheet adheres and detaches according to the flow direction of air that flows along the mesh plate.

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Inventors:

KIM SUNG HWAN (KR)

Application Number:

PCT/KR2017/013290

Publication Date:

July 26, 2018

Filing Date:

November 21, 2017

Export Citation:

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Assignee:

21TH CENTURY CO LTD (KR)

International Classes:

H01G4/30; H01G4/12

Foreign References:

JPH07164416A	1995-06-27
JP2002144270A	2002-05-21
JP2009246298A	2009-10-22
KR20050041780A	2005-05-04
KR20100029802A	2010-03-17

Attorney, Agent or Firm:

OH, Jong Hwan (KR)

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