Title:
UPPER-SIDE FORMED GLASS FOR HOT BORING AND PROCESS FOR PRODUCING BILLET FOR TUBE FORMATION BY HOT EXTRUSION
Document Type and Number:
WIPO Patent Application WO/2010/064507
Kind Code:
A1
Abstract:
A hollow billet is subjected to hot boring in which the hollow billet is inserted into a container and bored by hot-expanding the hollow with a plug inserted from above. A formed glass is used in the hot boring as an upper-side lubricant for the hollow billet, the formed glass comprising: a formed-glass ring part which has a disk shape having, at the center, a circular opening for inserting the plug thereinto; and a projecting ring part which has been fixed to the periphery of the opening of the formed-glass ring part and has a ring shape protruding perpendicularly to the formed-glass part. Hot boring with the formed glass is safe and can prevent the inner surface of the billet from developing defects.
Inventors:
NISHIMORI Junichi (5-33, Kitahama 4-chome, Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
西森 淳一 (〒41 大阪府大阪市中央区北浜四丁目5番33号 住友金属工業株式会社内 Osaka, 〒5410041, JP)
YAMAKAWA Tomio (5-33, Kitahama 4-chome, Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
山川 富夫 (〒41 大阪府大阪市中央区北浜四丁目5番33号 住友金属工業株式会社内 Osaka, 〒5410041, JP)
西森 淳一 (〒41 大阪府大阪市中央区北浜四丁目5番33号 住友金属工業株式会社内 Osaka, 〒5410041, JP)
YAMAKAWA Tomio (5-33, Kitahama 4-chome, Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
山川 富夫 (〒41 大阪府大阪市中央区北浜四丁目5番33号 住友金属工業株式会社内 Osaka, 〒5410041, JP)
Application Number:
JP2009/068459
Publication Date:
June 10, 2010
Filing Date:
October 28, 2009
Export Citation:
Assignee:
SUMITOMO METAL INDUSTRIES, LTD. (5-33, Kitahama 4-chome Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
住友金属工業株式会社 (〒41 大阪府大阪市中央区北浜四丁目5番33号 Osaka, 〒5410041, JP)
NISHIMORI Junichi (5-33, Kitahama 4-chome, Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
西森 淳一 (〒41 大阪府大阪市中央区北浜四丁目5番33号 住友金属工業株式会社内 Osaka, 〒5410041, JP)
YAMAKAWA Tomio (5-33, Kitahama 4-chome, Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
住友金属工業株式会社 (〒41 大阪府大阪市中央区北浜四丁目5番33号 Osaka, 〒5410041, JP)
NISHIMORI Junichi (5-33, Kitahama 4-chome, Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
西森 淳一 (〒41 大阪府大阪市中央区北浜四丁目5番33号 住友金属工業株式会社内 Osaka, 〒5410041, JP)
YAMAKAWA Tomio (5-33, Kitahama 4-chome, Chuo-ku, Osaka-sh, Osaka 41, 〒5410041, JP)
International Classes:
B21C23/32; B21C23/00; B21C23/08
Attorney, Agent or Firm:
MORI Michio et al. (M. MORI PATENT OFFICE, 17-23 Higashinaniwa-cho 5-chome, Amagasaki-sh, Hyogo 92, 〒6600892, JP)
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