Title:
URETHANE-MODIFIED POLYIMIDE RESIN SOLUTION
Document Type and Number:
WIPO Patent Application WO/2017/026174
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a novel urethane-modified polyimide resin solution that uses absolutely no high boiling-point, highly hygroscopic polar solvent. A urethane-modified polyimide resin solution containing: a urethane-modified polyimide resin (A) containing 30-90 mol% of amide-imide units (i) constructed from a trimellitic acid derivative and an aromatic diisocyanate component and 10-70 mol% of urethane units (ii) constructed from a compound of a specific structure and an aromatic diisocyanate component, taking the total structural components of the urethane-modified polyimide resin (A) as 100 mol%; and one or more organic solvents (B) selected from the group consisting of cyclohexanone and cyclopentanone.
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Inventors:
HATTORI TAKAHIRO (JP)
TANIGAWA MASAHITO (JP)
HAMANO MASAMI (JP)
TANIGAWA MASAHITO (JP)
HAMANO MASAMI (JP)
Application Number:
PCT/JP2016/068172
Publication Date:
February 16, 2017
Filing Date:
June 17, 2016
Export Citation:
Assignee:
TOYO BOSEKI (JP)
International Classes:
C08G18/34; C08G18/32; C08G18/48; C08G18/76; C08G73/10; C09D7/12; C09D11/102; C09D179/08
Domestic Patent References:
| WO2011062137A1 | 2011-05-26 |
Foreign References:
| JP2014062237A | 2014-04-10 | |||
| JP2011046762A | 2011-03-10 | |||
| JP2009280727A | 2009-12-03 |
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