POLYCRYSTALLI E DIAMOND

RELATED APPLICATIONS

[0001] The present application is related to U.S. Patent Application No.

13/401,188, entitled "Use of Capacitance to Analyze PolycrystalJme Diamond" and tiled on February 21 , 2012, U.S., Patent Application No. 13/401 ,231 , entitled "Use of Eddy Currents to Analyze Polycrystaliine Diamond" and filed on February .21 , 2012, arid U.S. Patent Application No. 13/401 ,452, entitled "Method. To Improve The Performance Of A. Leached Cutter" and filed on February 21, 2.012, which are all incorporated by reference herein.

TECHNICAL FIELD

[0002] The present invention relates generally to methods and apparatuses for measuring characteristics of one or more regions within an ultra-hard polycrystaliine structure; and more particularly, to no -desirueti ^' ve methods and apparatuses for measuring the leaching depth within the ultra-hard polycrystaliine structure and/or characterizing at least a portion of the ultra-hard polycrystaliine structure, such as the ones used in forming polycrystaliine diamond compact ("PDC") cutters, using at least capacitance and eddy current measurements.

BACKGROUND

[0003] Polycrystaliine diamond compacts ("PDC") have been used in industrial applications, including rock drilling applications and metal machining applications. Such compacts have demonstrated advantages over some other types of cutting elements, such as better wear resistance and impact resistance. The PDC can be. formed by sintering individual diamond particles together under the high pressure and high, temperature ('ΉΡΗΤ') conditions referred to as the "diamond stable region," which is typically above forty ki lobars and between 1,200 degrees Celsius and 2,000 degrees Celsius, in the. presence of a catalyst/solvent which, promotes diamond- diamond bonding. Some examples of catalyst/solvents for sintered diamond compacts are cobalt, nickel, iron, and other Group VIII. metals, PDCs usually have a diamond content greater than, seventy percent by volume, with about eighty percent to about ninety-eight percent being typical. An unbacked PDC can be mechanically bonded to a tool (not shown), according to one example. Alternatively, the PDC is bonded to a substrate, thereby terming a PDC cutter, which is typically inseriab!e within a dowhhole tool (not shown), such, as a. drill bit or a reamer,

[0004] Figure 1 shows a side view of a PDC cutter 100 having a po!ycrysta!!ine diamond ("PCD") cutting table 110, or compact, in accordance with the prior an. Although a PCD cutting table 1 10 is described in the exemplary embodiment,, other types of cutting tables, including noncrystalline boron nitride C'PCSN") compacts, are used in alternative types of cutters. Referring to Figure 1 , the PDC cutter 100 typically includes the PCD cutting table 1 10 and a substrate 150 that is coupled to the PCD cutting table ί.1.0. The PCD cutting table 110 is about one hundred thousandths of an- inch (2.3 millimeters) .thick however, the thickness is variable depending upon the application in. which the PCD cutting table 1 10 is to be used.

[0005] The substrate 150 includes a top surface 152, a bottom surface 154, and a. substrate outer wall 156 that extends from the circumference of the top surface 152 to the circumference of the bottom surface 154. The PCD cutting table 1 10 includes a cutting -surface 1 12. an opposing surface 114, and a PCD cutting table outer wall 1 16 that extends from the circumference of the cutting surface- 1 12 to the circumference of the opposing surface 1 14. The opposing surface 1 14 of the PCD cutting table .1 10 is coupled to the top surface 152 of the substrate 150. Typically, the PCD cutting table 110 is coupled to the substrate 150 using a high pressure and high temperature ('ΉΡΗΤ') press. However, other methods known to people having ordinary skill in the art can be used to couple the PCD cutting table 110 to the substrate 150. In one embodiment, upon coupling the PCD cutting table 1 10 to the substrate 150, the cutting surface 1 2 of the PCD cutting table 110 is substantially parallel to the substrate's bottom surface 154. Additionally, the PDC cutter 100 has been -illustrated as having a right circular cylindrical shape; however, the PDC cutter 100 is shaped into other geometric or non-geometric shapes in other exemplary embodiments. In certain exemplary embodiments, the opposing surface 114 and the lop surface 152 are substantially planar; however, the opposing surface 1 14 and the top surface 152 are non-planar in other exemplary embodiments. Additionally, according to some exemplar}' embodiments, a bevel (not shown) is farmed around at least the circumference of the cutting surface 1 12.

[0006] According to one example, the PDC cutter 100 is formed by independently forming the PCD cutting table ! 10 and the substrate 150, and thereafter bonding the PCD cutting table 1 10 to the substrate 350, Alternatively, the substrate 150 is initially formed and the PCD cutting table 1 10 is subsequently formed on the top surface 152 of the substrate 150 by placing polyerystaHine diamond powder onto the top surface 152 and subjecting the polyerystaHine diamond powder and the substrate 150 to a high temperature and high pressure process. Alternatively, the substrate 150 and the PCD cutting table 110 are formed .and bonded together at about the same time. Although a few methods of formin the PDC cutter 100 have been briefly mentioned, other methods known to people: having ordinary skill in the art can be used.

[0007] According to one example for f nriing the PDC cutter 100, the PCD

■cutting table 1 10 is formed and bonded to the. substrate 150 by subjecting a layer of diamond powder and a mixture of tungsten carbide and cobalt, powders to HPHT conditions. The cobalt is typically mixed with tungsten carbide and positioned where the substrate 1.50 is to be formed. The diamond powder is placed on top of the cobalt and tungsten carbide .mixture and positioned, where the PCD cutting table 11 is to fee formed. The entire powder mixture is. then subjected to BPHT conditions so that the cobalt melts and facilitates the cementing, or binding, of the tungsten carbide to form the substrate 150. The melted cobalt also diffuses, or infiltrates, into the diamond powder and acts, as a catalyst for synthesizing diamond bonds and forming the PCD cutting table 1 10, Thus, the cobalt acts as both a binder for cementing the tungsten carbide and as a catalyst solvent for sintering the diamond powder to form diamond- diamond bonds, The cobalt also facilitates in fonning strong bonds between the PCD cutting table 1 10 and the cemented tungsten carbide substrate 150.

[0008] Cobalt has been a preferred constituent of the PDC manufacturing process. Traditional PDC manufacturing, processes use cobalt as the binder material for forming the substrate 150 and also as the catalyst material for diamond synthesis ^' because of the large body of knowledge related to using cobal in these processes. The synergy between the large bodies of knowledge and the needs of the process have fed to using cobalt as both the binder material and the catalyst material. However, as is known in the art, alternative metals, such as iron, nickel, chromium, manganese, and tantalum, and other suitable materials, can be used as a catalyst for diamond synthesis. When using these alternative materials as a catalyst for diamond synthesis to form the PCD cutting table 10, cobalt, or some other material such as nickel chrome or iron, is typically used as the binder material for cementing the tungsten carbide to form the substrate 150. Although some materials, such as tungsten carbide and cobalt, have been provided as examples, other materials known to people having ordinary skill in the art ears be used to form the substrate 150, the PCD cutting table 1 10, and the bonds between the substrate 150 and the PCD cutting table 1 10.

[0009] Figure 2 is a schematic .microstructural view of the PCD cutting table

1 10 of Figure 1 in accordance with the prior art. Referring to Figures 1 and 2, the PCD cutting table 1 10 has diamond particles 210 bonded to other -diamond particles 210, one or more interstitial spaces 212 formed ^' between the diamond particles 210, and cobalt 214, or some other catalyst, deposited within one or more of the interstitial spaces 212. During the sintering process, the interstitial spaces 212, or voids, are formed between the carbon-carbon bonds and are located between the diamond particles 210. The diffusion of cobalt 2 4 into the diamond powder results in cobalt 214 being deposited within these interstitial spaces 212 that are formed within, the PCD cutting table 110 during the sintering process.

[0010] Once the PCD cutting table 110 is formed and placed into operation, the PCD cutting table 110 is known to wear quickly when the temperature reaches a. critical temperature. This critical temperature is about 750 degrees Celsius and is reached whe the PCD cutting table 1 1 is cutting rock formations or other known materials. The high rate of wear is believed to be caused by the differences in the thermal expansion rate between the diamond particles 210 and the cobalt 214 and also by the chemical reaction, or graphitization, that occurs between cobalt 214 and the diamond particles 210. The coefficient of thermal expansion for the diamond particles 210 is about 1.0 x 10 ^"6 millimeters ^"1 x Kelvin ¹ f'mm^K "), while the coefficient of thermal expansion for the cobalt 214 is about 13.0 x 10 ^' * mm ^'l K ^'1 . Thus, the cobalt 21.4 expands much faster than the diamond particles 210 at temperatures above this critical temperature, thereby making the bonds between the diamond particles 210 -unstable. The PCD cutting table 1 10 becomes thermally degraded at temperatures above about 750 degrees Celsius and its cutting efficiency deteriorates si gnificantiy,

[0011] Efforts have been made to slow the wear of the PCD cutting table 1 ID at these high temperatures, These efforts include performing a leaching process on the PCD cutting table 110, which removes some of the cobalt 214 from, the interstitial spaces 212. These leaching processes, which includes, but is not limited to, an acid leaching process and/or an electrolytic leaching process, is known to persons having ordinary skill in the art and -is not described herein for the sake of brevity. By removing some of the cobalt 214, or catalyst, from, th PCD cutting table 110, the thermal degradation of the PCD structure is reduced ,

[0012] Figure .3 shows a cross-section view of a leached PDC cutter 300 having a PCD cutting table 310 that has been at least partially leached in accordance with the prior art. Referring to F gure 3, the PDC cutter 300 Includes the PCD cutting table 310 coupled to a substrate 350, The substrate 350 is similar to substrate 150 (Figure 1 ) and is not described again for the sake of brevity. The PCD cutting table 310 is similar to the PCD cutting table 1 10 (Figure 1), but includes a leached layer 354 and an ua!eaehed layer 356. The leached layer 354 extends from the cutting surface 312. which is similar to the cutting surface 1 12 (Figure 1.), towards an .opposing surface 314, which is similar to the opposing surface 1 14 (Figure I). In the leached layer 354, at least a portion of the cobalt 214 has been removed from within the interstitial spaces 212 (Figure 2) using at least one leaching process metitioned above. Thus, the leached layer 354 has been leached to a desired depth 353. However, durin the leaching process, one or more by-product materials 398 are formed and deposited within some of the interstitial spaces 212 (Figure 2) in the leached layer 354. The unieached layer 356 is similar to the PCD cutting table 150 (Figure 1) and extends from the end of the leached layer 354 to the opposing surface 314. In the nnleached layer 356, the cobalt 214 (Figure 2) remains within the interstitial spaces 212 (Figure 2). Although a boundary line 355 is formed between the leached layer 354 and the unleacbed layer 356 and is depicted as being substantially linear, the boundary line 355 ca be non-linear, [0013] The leached PDC cutters 300 are leached to different desired depths

353 and how deep the cutter 300 has been leached has an effect on the performance of the cutter 300. Conventionally, the leached depth 353 of the cutter 300 is measured, or determined, by cutting the cutter 300 vertically in half a d then subsequently polishing the cutter 300. The leached depth 353 is visually measured under a microscope or similar magnifying device. This process is rather tedious and cumbersome as it involves cutting the cutter 300, such as by electrical discharge machining ("EDM"), mounting- grinding, and polishing the cutter 300, and perfonning an analysis under a microscope. Additionally, this process destroys the cutter 300 from subsequently being used. The leached depth 353 that is determined in this manner is assumed to be _. the same leached dept in other cutters thai were leached in the same batch.

BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The foregoing -and other features and aspects of the ^' invention are best understood with reference to the following description of certain exemplary embodiments, when read in conjunction with the .accompanying drawings, wherein:

[0015] Figure I is a side view of a PDC cutter having a polycrystafl ne diamond, cutting table, or compact, in accordance with the prior art;;

[0016] Figure 2 is a schematic microstractura! view of the PCD cutting table of Figure 1 in accordance with the prior art;

[0017] Figure 3 is a cross-section, view of a PDC cutter having a PCD cutting table that has been at least partially leached in accordance with the prior art;

[0018] Figure 4 is a schematic view of a capacitance measuring system in accordance to one exemplary embodiment of the present invention;

[0019] Figure 5 is a schematic view of a capacitance measuring system in accordance to another exemplary embodiment of the present invention;

[0020] Figure 6 is a schematic view of an eddy current testing system in accordance to one exemplary embodiment of the present in vention;

[0021] Figure 7 A is a graphical chart showing a plurality of shallow leached amplitude curves and a plurality of shallow leached phase angle shift curves for each of a plurality of shallow leached PDC cutters using the eddy current testing system of Figure 6 in accordance with a exemplary embodiment;

[0022] Figure 7B is -a graphical chart showing a plurality of deep leached amplitude curves and .a plurality of deep leached phase angle shift curves for each of a plurality of deep leached PDC cutters using the eddy current testing system of Figure 6 hi accordance with an exemplary embodiment;

[0023] Figure 7C shows a graphical chart depicting both the amplitude curves and the phase angle shift curves of Figures 7A and 7B for each of the shallow leached PDC cutters and deep leached PDC cutters using the same scale in accordance with m exemplar}- ¹ embodiment;

[0024] Figure 8 is. a flowchart depicting a nors -destructive leaching depth estimation method in accordance with an exemplary embodiment of the present invention;

[0025] Figure 9 is a graphical chart depicting a first calibration curve that shows .a relationship between capacitance and actual leaching depth for a plurality of leached components in accordance with an exemplary embodiment of the present invention;

[0026] Figure I OA is a graphical chart depicting a second calibration curve thai shows a relationship between eddy current and actual leaching depth for a plurality of leached components in accordance with an exemplary embodiment of the present invention;

[0027] Figure 1-OB is a partial, view of the graphical chart of Figure 10A in accordance with an exemplary embodiment of the present invention;

[0028] Figure 11 is a flowchart depicting a microstructural quality determination method in accordance with an exemplary embodiment of the present invention; and

[0029] Figure 12 Is a data scattering chart that shows the measured capacitance for a plurality of leached cutters- from a same leaching batch in accordance w t an exemplary embodiment of the present invention.

[0030] The drawings illustrate only exemplary embodiments of the invention and are therefore not to be considered limiting of its scope, as the invention may admit to other equally effective embodiments. BRIEF DESCRIPTION OF EXEMPLARY EMBODIMENTS

[0031 ] The present invention is directed to. a non-destructive method and apparatus for measuring the leaching depth within an ultra-hard pofycrystalline structure and/or characterizing at least a portion of the ultra-hard -polycrysiailme structure, such as the ones used in forming poiyerysia!line diamond compact ("PDC") cutters, using at least capacitance and eddy current measurements. Although the description of exemplary embodiments is provided below in conjunction with a PDC cutter, alternate embodiments of the invention may be applicable to other types of polyerysialline structures including, but not limited to,. PCBN cutters. Further, according to some exemplary embodiments, one or more portions of the methods described below is implemented using an electronic measuring device. For example, the capacitance is measured using a capacitance measuring device and the eddy current is measured using an eddy .current ^' measuring device. The invention is better understood by reading the ^' following description of non-limiting, exemplary embodiments with reference to the attached drawings, wherein like parts of each of the figures are identified by like reference characters, and which are briefly described as follows.

[0032] Figure 4 is a schematic view of a capacitance measuring system 400 in accordance to one exemplary embodiment of the present invention. Referring to Figure- 4, the capacitance- measuring system 400 includes a capacitance measuring device 410, the leached PDC cutter 300, a first wire 430, .and a second wire. 440. Although certain components have been enumerated as being included in the capacitance measuring system 400, additional components are included i other exemplary embodiments. Additionally, although the description provided below has been provided with respect to the leached PDC cutter 300, a different component, such as the PCD cutting table 310 alone or other component that includes another type of leached po!ycrysialline structure, is used in .lieu of the leached PDC cutter 300. Additionally, although the descriptio provided below has been provided with respect to the leached PDC cotter 300, a different component, such as a chemically cleaned leached PDC cutter (not shown), is used in Lieu of the leached PDC cutter 300. The chemically cleaned leached PDC cutter has had at least a portion of the by-product materials 398 (Figure 3) removed by using one or more processes described in related application entitled, "Method To improve The Performance Of A Leached Cutter", which has been mentioned above and incorporated by reference herein. The leached PDC cutter 300 has been previously described with respect to Figure 3 and is not repeated again herei for the sake of brevity.

[0033] The capacitance measuring device 410 is a device that measures the capacitance of an energy storage device, which is the leached PDC" cutter 300 in the instant exemplary embodiment Capacitance is a measure of the amount of electric potential energy stored, or separated, for a given electric potential A common form of energy storage device is a para! lei-plate capacitor. In the instant exemplary embodiment, the leached PDC cutter 300 is an example of the parallel-plate capacitor. The capacitance of the energy storage device is typically measured hi farads, or nan faradS:

[0034] One example of the capacitance measuring device 410 is a multimeter; however, other capacitance measuring devices known to people having ordinary skill in the art are used in one or more alternative exemplary embodiments. The multi-meter 410 includes a positionable dial 412, & plurality of measurement settings 414, a display 416, a positive terminal 418. and a negative terminal 1 . According to some exemplary embodiments, the positionable dial 412 is rotatahle in a clockwise and'Or counter-clockwise manner and is set to one of several available measurement settings 414. In the instant exemplary embodiment, the positionable dial 412 is set to a nanofaraday setting 415 so that the multi-meter 410 measures capacitance values. The display 416 is fabricated using polycarbonate, glass, plastic, or other known suitable material and communicates a measurement value, such as a capacitance value, to a user (not shown) of the multi-meter 4 0. The positive terminal

418 is electrically coupled to one end of the first wire 430, while t he negative terminal

419 is electrically coupled to one end of the second wire 440.

[0035] The first wire 430 is fabricated using a copper wire or some other suitable conducting material or alloy known to people having ordinary skill in the art. According to some exemplary embodiments, the first wire 430 also includes a nonconducting sheath (not. shown) thai surrounds the copper wire and extends from, about one end of the copper wire to an opposing end of the cooper wire. The two ends of the copper wire are exposed and are not surrounded by the non-conducting sheath. In some exemplary embodiments, n insulating material (not shown) also surrounds the copper wire and is disposed between the copper wire and the non-conducting sheath. The insulating material extends from about one end of the non-conducting sheath to about an opposing end of the non-conducting sheath. As previously mentioned, one end of the first wire 430 is electrically coupled to the positive terminal 418, while the opposing end of the first wire 430 is electrically coupled to the cutting surface 312 of the leached PDC cutter 300. The opposing end of the first wire 430 is electrically coupled to. the cutting surface 312 in one of several methods. In one example, the first wire 430 is electrically coupled to the cutting surface 312 using one or more fastening devices (not shown), such as a clamp, or using an equipment (not -shown) that supplies a force to retain -the first wire 430 in electrical contact with the cutti g surface 312. in another example, a clamp (not shown) is coupled to the opposing end of the first wire 430 and a conducting component (not shown), such as aluminum roil, is coupled to, or placed in contact with, the cutting surface 312. The damp is electrically coupled to the conducting component, thereby electrically coupling the first wire 430 to the cutting surface 312, Additional methods for coupling the first wire 430 to ^' the cutting surface- 312 can be used in other exemplary embodiments.

[0036] ^' The second wire 440 is fabricated using a copper wire or some other suitable conducting material or alloy !knowft to ^' people ^' having ordinary skill in the art. According to some exemplary embodiments, the second wire 440 also Includes a nonconducting sheath (not. shown) that surrounds the coppe wire and extends from, about one end of the copper wire to an opposing end of the cooper wire. The two ends of the copper wire are exposed and are not surrounded by the non-conducting sheath. In some exemplary embodiments, an insulating material (not shown) also surrounds the copper wire and is disposed between the copper wire and the non-conducting sheath. The .insulating material extends from about one end of the non-conducting sheath to an opposing end of the non-conducting sheath. As previously mentioned, one end of the second wire 440 is electrically coupled to the negative terminal 4.1 , while the opposing end of the second wire 440 is electrically coupled to a bottom surface 454, which is similar to the bottom surface 154 (Figure 1). of the leached PDC cutter 300, The second wire 440 is electrically coupled to the bottom surface 454 in a similar manner as the first wire 430 is electrically coupled to the cutting surface 312.

[0037] Hence, a circuit 405 is completed using the multi-meter 410, the first wire 430, the leached PDC cutter 300, and the second wire 440. The current is able to flow from the positive terminal 418 of the multi-meter 410 to the cutting surface 312 of the leached PDC cutter 300 through the first wire 430. The current then flows through the leached PDC cutte 300 to the bottom surface 454 of the leached PDC cutter 300. When the multi-meter 410 is turned on, a voltage differential exists between the cutting surface 312 and. the bottom .surface.454. The current then flows from, the bottom, surfac 454 to the negative terminal. 419 of the multi-meter 410 through the second wire 440. The capacitance measurement- of the leached PDC cutter 300 is, determined when the value displayed on the display 416 reaches a peak value or remains constant for a period of time.

[0038] Figure 5 is a schematic view of a capacitance measuring _, system. 500 in

^• accordance to another exemplary embodiment of the present invention. Referring to Figure 5, the capacitance measuring- system 500 includes the capacitance measuring device 410, the leached PDC cutter 300, the first wire 430, the second wire 440, a first conducting material 51.-0 _. , a second conducting material 5.20, a first insulating material 530. a second insulating material 540, and an Arbor Press 550. Although certain components have beep enumerated as being included in the capacitance measuring system 500, additional components: are included hi other exemplary embodiments, Further, although certain components have been enumerated ^' as being included in the capacitance measuring system 500, alternative components having similar functions as tire enumerated components are used in alternative exemplary embodiments. Additionally, although the description provided below has been provided with respect to the leached PDC cutter 300, a different component, such as the PCD cutting table 310 (Figure 3} alone or other component that includes another type of leached, polycrystailine structure, is used in lieu of the leached PDC cutter 300. Additionally, although the description provided below has been provided with respect to the leached PDC cutter 300, a different component, such as the chemically cleaned leached PDC cutter mentioned above, is used in lieu of the leached PDC cutter 300. The capacitance measuring device 410. the leached PDC cutter 300, the first wire 430, and the second wire 440 have, been previously described and are not repeated again herein for the sake of brevity.

[0039] The first conducting material 510 and the second conducting material

520 are similar to one another in certain exemplary embodiments, but are different in other exemplary embodiments. According to one exemplary embodiment, the conducting materials 510, 520 are fabricated using aluminum foil; however, other suitable conducting materials can be used. The first conducting material 510 is positioned adjacently above and in contact with the cutting surface 3 2, The second conducting material 520 is -positioned: adjacently below and in contact with the bottom surface 454, The first conducting -material 510 and the second conducting material 520 provide ^' an area. to which the first wire 430 and the second wire 440, respectively, make electrical contact Additionally, the first conducting material 510 and the second conducting material 520 assist in minimizing contact resistance with the cutting surface 312 -and the bottom surface 454, respectively, which is discussed in further detail below, in certain exemplary embodiments, the first conducting material 510 and the -second conducting material 520 are the same shape and size; while In other exemplary embodiments, one of the conducting materials 510, 520 is a different shape and/or size than the other conducting material 510. 520.

[0040] The first insulating material 530 and the second insulating material 540 are similar to one another in certain exemplary embodiments, but are different in other exemplary embodiments. According to one exemplary embodiment, the insulating materials 530, 540 are fabricated using paper; however, other suitable insulating materials, such as rubber, can be used.. The first insulating material 530 is positioned adjacently above and in contact with the first conducting material 510, The second insulating material 540 is positioned adjacently below and in contact with the second conducting material 520. The first insulating material 530 and the second insulating material 540 provide a barrier to direct current flow only through a circuit 505, which is discussed in further detail below, in certain exemplary embodiments, the first insulating material 530 and the second nsulating material 540 are the same shape and size; while in other exemplary embodiments, one of the insulating materials 530, 540 is a different shape and/or size than the other insulating material 530, 540. Additionally, in certain exemplar}' embodiments, the insulating materials 530, 540 is larger in size than lis corresponding conducting material 510, 520. However, one or more of the insulating materials 530, 540 is either larger or smaller than, its corresponding conducting material 510, 520 in alternative exemplary embodiments.

[0041 ] The Arbor Press 550 includes an upper plate 552 and a base plate 554.

The upper plate 552 is positioned above the base plate 554 and is movable towards the base plate 554. In other exemplary embodiments, the base plate 554 s movable towards the upper plate 552. The first insulating material 530, the first conducting material 510, the leached PDC cutter 300, the second conducting material 520. and the second insulating material 540. are positioned between, the upper plate.552 and the base plate 554 such that the second insulating material 540 is positioned adjacently above and in contact with the base plate 554. The upper plate 5.52 is moved towards the base plate 554 until the upper plate 552 applies a downward load 553 onto the cutting surface 312 of the leached PDC cutter 300. When the downward load 553 is applied, the first conducting material 510 is deformed and adapted to the rough and very stiff cuttin surface 312, thereby minimizing contact, resistance between the first conducting material 510 and the- cutting surface 312 and greatly improvin the capacitance measuremen consistency. A this time, the base plate 554 also applies an upward, load 555 onto the bottom surface 454 of the leached PDC cutter 300. Whe the upward load 555 is applied, the second conducting material 520 is deformed and adapted to the rough and very stiff bottom surface 454, thereby minimizing contact resistance between the second conducting materia! 520 and the bottom surface 454 and greatly improving the capacitance measurement consistency, In certain exemplary embodiments, the downward load 553 is equal to the upward load 555. The downward load 553 and the upward load 555 is about one hundred pounds; however, these loads 553, 555 range from about two pounds to about a critical load. The critical. load is a load at which the leached PDC cutter 300 is damaged when applied thereto,

[0042] In one exemplary embodiment, the second insulating material 540 is positioned on the base plate 554, the second conducting material. 520 is positioned on the second insulating material 540, the leached PDC cutter 300 is positioned on the second conducting material 520. the first conducting material 510 is positioned on the leached PDC cutter 300, and the first insulating material 530 is positioned on the first conducting material 510. The upper plate 552 is moved towards the first insulating material 530 until the downward load 553 is applied onto the leached PDC cutter 300. In an alternative exemplary embodiment, one or more components, such as the first insulating material 530 and the first conducting material 510, are coupled to the upper plate 552 prior to the upper plate 552 being moved towards the base plate 554. Although an Arbor Press 550 is used in the capacitance measuring system 500, other equipment capable of delivering equal and opposite loads la each of the cutting surface 312 and the bottom surface 454 of the leached PDC cutter 300 can be used in other exemplary embodiments,

[0043] One end. of the first wire 430 is electrically coupled to the positive terminal 418 of the .multi-meter 410, while the opposing end of the first wire 430 is electrically coupled to the first conducting material 510, which thereby becomes electrically coupled to the cutting surface 312 of the leached PDC cutter 300. In one exemplary embodiment, a clamp 590. is coupled to the opposing end of the first wire 430 which couples the first wire 430 to the first conducting material 510. One end of the second wire 440 is electrically coupled to the negative terminal 419 of the multimeter 10, while the opposing end of .the second wire 440 is electrically coupled to the second conducting material 520, which thereby becomes electrically coupled to the bottom surface- 454 of the leached PDC cutter 300. In one exemplary embodiment, a clamp (not shown), similar to clamp 590, is . ^' coupled to the opposing end of the second wire 440, which couples the second wire 440 to the second conducting material 520. Hence, the circuit 505 is completed using the multi-meter 410, the first wire 430, the first conducting material 510, the leached PDC cutter 300, the second conducting material 520, and. the second, wire 440. The current is able to flow from, the positive terminal 418 of the multi-meter 41.0 to the cutting surface 312 of the leached PDC cutter 300 through the first wire 430 and the first conducting material 510. The current then flows through the leached PDC cutter 300 to the bottom surface 454 of the leached PDC cutter 300. When d e multi-meter 410 is turned on, a voltage differential exists between the cutting surface 312 and the bottom surface 454. The current then flows from the bottom surface 454 to the negative terminal 419 of the multi-meter 4.10 through the second conducting material 520 and the second wire. 440, The first insulating material 530 and the second insulating material 540 prevent the current from flowing into the Arbor Press 550. The capacitance measurement of the leached PDC cutter 300 is determined when the value displayed on the display 416 reaches a peak value or remains constant for a period of time,

[0044] Figure 6 is a schematic view of an eddy current testing system 600 in accordance to one exemplary embodiment of the present invention. Referring to Figure 6, the eddy current testing system 600 includes an eddy current testing device 610, the leached PDC cutter 300, a first wire 630, and a probe 640, which collectively form a circuit 605 (described below) when electrically- coupled to one another. Although certain components have been enumerated as being included in the eddy current testing system 600, additional components are- included in other exemplary embodiments. Additionally, although the description provided below has been provided with respect to the leached PDC cutter 300, a different component, such as the. PCD cutting table 310 alone or other component that includes another type - of leached polycrystailine structure, is used in lieu of the _. leached PDC cutter 300, Additionally, although the description provided below has been provided with respect to the leached. PDC cutter 300, a different component, such as a chemically cleaned leached PDC cutter (not .shown), is used in lieu of the leached PDC cutter 300. The chemically cleaned leached PDC cutter has had at least a portion of the by-product materials 398 (Figure 3) removed by using one or more processes described in related application entitled, "Method To mprove The Performance Of A Leached Cutter", which has been mentioned above and incorporated by reference herein. The leached. PDC cutter 300 has been previously described with respect to Figure 3 and is not repeated again herein for the sake of brevity.

[0045] The eddy current testing device 610 is a device that measures eddy currents, which, includes at least one of an impedance amplitude and or a phase angle shift, of the circuit 605 through which alternating current ("AC current") travels. The eddy current testing device 610 includes at least a display 616 and a first terminal 618. The display 616 is fabricated using polycarbonate, glass, plastic, or other known suitable material and communicates one or more measurement values, such, as the impedance amplitude and/or the phase angle shift; to a user (not shown) of the eddy current testing device 10. The first terminal 618 is electrically coupled to one end of the first wire 630 and supplies alternating current ("AC current") therethrough. In certain exemplary embodiments, the eddy current testing device 610 includes a power supply terminal 619, which is electrically coupled to a power supply source (not shown). For example, a second wire (not shown) with a plug (not shown) electrically couples the power supply terminal 61.9 to a wall outlet (not shown), which is a source for alternating current Alternatively, the eddy current testing device 610 is powered by one or more batteries (not shown) or other known power supply source. The eddy current testing device 610 displays these measurements in graphical form according to some exemplary embodiments, which can be then analyzed to determine the quantitative and/or the qualitative measurements for eddy currents. Alternatively, one or more of the impedance amplitude and/or the phase- angle shift measurements are displayed digitally, or quantitatively, on the display 616.

[0046] The first wire 630 is. fabricated using a copper wire or some other suitable conducting material or alloy known to people having ordi ary skill in the art. According to some exemplary embodiments, the first wire 630 also includes a nonconducting sheath (not shown) that surrounds the copper wire and extends from about one end of the copper wire to an. opposing end of the cooper wire. The two ends of the copper wire are exposed and are not surrounded by the. non-conducting sheath. In some exemplary embodiments, an insulating material (not shown) also surrounds the copper wire and is disposed between the copper wire and the non-conducting sheath. The insulating material, extends from about one end of the nonconducting sheath t about an opposing end of the non-conducting sheath. As previously mentioned, one end of the first wire 630 is electrically coupled to ^' the first terminal 6 I S. In certain exemplaiy embodiments, an adapter (not shown), or other suitable device, is coupled to the one end of the first wire 630 which also is Insertable into the first terminal 61 . The opposing end of the first wire 630 is electrical ly coupled to the probe 640,

[0047] lire probe 640 includes a coil conductor (not shown) therein, which is electrically coupled to the first wire 630. According to some exemplary embodiments, the probe 640 is eylmdrically shaped and includes a ^' substantially planar first end 642 which is opposite- the end at which the first wire 630 is coupled to the probe 640. However, in other exemplary embodiments, the probe 640 is shaped differently. The first end 642 is positioned in contact with the cutting surface 312 of the leached PDC cutter 300. Thus, the coil conductor transports the alternating current towards the leached PDC cutter 300,

[0048] Hence, the circuit 605 is completed using the eddy current testing device 610, the first wire 630, the probe 640, and the leached PDC cutter 300. Once the eddy current testing device 610 is turned on, the alternating current flows from the eddy current testing device 610 to the coil conductor of the probe 640 through the first wire 630. The probe 640 creates a magnetic field. The probe 640 is in close proximity to a second conductor, or the unleached layer 356 (Figure 3) of the leached PDC cutter 300, and is separated by a distance defined by the leached layer 354 {Figure 3) of the leached PDC cutter 300, which also is referred to a the leached depth 353 (Figure 3). This close proximity induces eddy currents in the ^' unleashed layer 356 (Figure 3), or second conductor, which is proportional to the frequency of the. alternating current field. The distance that the coil conductor, or probe 640, is from the second conductor 356 (Figure 3), which, has been mentioned above, is called liftoff This distance affects, the mutual inductance of the circui t 605 and is related to the. impedance amplitude and/or a phase angle shift of the circuit 605, which is discussed in further detail below. Thus, the leached depth 353 (Figure 3) is determinable, either quantitatively and/or qualitatively, from the measured impedance amplitude and/or phase angle shift of the circuit 605. Further, the quality of leaching, i.e. the _. removal of catalyst material from within the leached layer 354 (Figure 3), and/or the microsirueture characteristics, e.g. the porosity, is determinable, at least qualitatively, from, the measured impedance amplitude and/or phase angle shift of the circuit 605. Specifically, when repeated tests on a leached PDC cutter 300 exhibits less scattered results tor the measured impedance amplitude, and/or phase angle shift of the circuit 605, the leached PDC earner 300 has a better quality of leaching and/or a better microsirueture characteristic.

[0049] Figure 7 A is a graphical chart 700 showing a plurality of shallow leached amplitude curves 7.10 and a plurality of shallow leached phase angle shift curves 715 for each of a plurality of shallow leached PDC cutters 705 using the eddy- current testing system 600 (Figure 6} in accordance with an exemplar embodiment. The shallow leached PDC cutter 705 is similar to the leached PDC cutter 300 (Figure 3), but the leached depth 353 (Figure 3) is a shallow leached depth. A shallow leached depth typically ranges from about forty to seventy microns, but can be greater or lesser than this ange in other exemplary embodiments. Referring to Figure 7 A, the longitudinal length of each of the shallow leached amplitude curves 710 provides a measurement of the impedance amplitude 702 for the respective shallow leached PDC cutter 705. Similarly, the slope of each of the shallow leached phase angle shift curves 715 provides a measurement of the phase angle shift 704 for the respective shallow leached PDC cutter 705. Typically, the phase angle shift 704 is determined when analyzing the end of the shallow leached phase angle shift curve 715. The graphical chart 700 shows three shallow leached amplitude curves 710 and three shallow leached phase angle shift curves 71.5 for each of the ten shallow leached PDC cutters 705 thai were tested using the eddy current testing system 600 (Figure 6). The impedance amplitude 702 is determined from each of the shallow leached amplitude curve 710* while the phase angle shift 704 is determined from each of the shallow leached phase angle shift curve 715.

[0050] Figure 7B is a graphical chart 750 showing a plurality of dee leached amplitude curves 760 and a plurality of deep leached phase angle shift curves 765 for each of a plurality of deep leached PDC cutters 755 using the eddy current testing system 600 (Figure 6) in. accordance with an exemplary embodiment. The deep leached PDC cutter 755 is similar to the leached PDC cutter 300 (Figure 3), but the leached depth 353 (Figure 3) is a deep leached depth. A deep leached depth typically ranges from, about 240 to 300 microns, but can be greater or lesser than this range in other exemplary embodiments. Referring to Figure 7B, the longitudinal length of each of t e deep leached amplitude curves 760 provides a measurement of the impedance amplitude 702 for the respective deep leached PDC cutter 755. Similarly, the slope of each of the deep leached phase angle shift curves 765 provides a measurement of the phase angle shift 704 for the respective deep leached PDC cutter 755. Typically, the phase angle shift 704 is determined when analyzing the end of the deep leached phase angle shift curve 765. The graphical chart 750 shows three deep leached amplitude curves 760 and three deep leached phase angle shift curves 765 for each of the ten deep leached PDC cutters 755 thai were tested using the eddy current testing system 600 (Figure 6). The impedance amplitude 702 is determined from each of the deep leached amplitude curve 760, while the phase angle shift 704 is determined from each of the deep leached phase angle shift curve 765. Although. Figures 7A and 7B show the test, results for shallow leached PDC cutters 705 and deep leached PDC cutters 755, respectively, these test results are not comparable with one another since the scales used in depicting the amplitude curves 710, 760 and the phase angle shift curves 715, 765 are different for each of the figures. Hence, Figure 7C shows a graphical chart 790 depicting both the amplitude curves 710, 760 and the phase angle shift curves 715, 765 of Figures 7A and 7B for each of the shallow leached PDC cutters 70S and deep leached PDC cutters 755 using the same scale in accordance with an exemplary embodiment According to Figure 7C, the impedance amplitude 702 for the shallow leached amplitude curves 71.0 is smaller than the impedance amplitude 702 for the deep leached amplitude curves- 760. Conversely, the phase angle shift 704 for the shallow leached phase angle shift curves 71 5 is larger than the phase angle shift 704 for the deep leached phase angle shift curves 765.

[0051] Figure 8 is a flowchart depicting a non-destructive leaching depth estimation method 800 in accordance with an exemplary embodiment of the present invention. Although Figure 8 shows a series of steps depicted in a certain order, the order of one or more steps can be rearranged, combined into fewer steps, and/or separated into more steps than that shown in other exemplary embodiments. Referring to Figure 8, the nondestructive leaching depth estimation method 800 begins at step 810, Upon starting at. step 810, the non-destructive leaching depth estimation method 800 proceeds to step 820. At step 820, a first calibratio -carve is obtained. The .first calibration curve can. be generated from tests or acquired troth elsewhere.

[0052] Figure 9 is & graphical char 900 depicting the first calibration curve

905 that shows a relationship between capacitance 910 and actual leaching depth 920 for a plurality of leached components 300 (Figure 3) in accordance with an exemplary embodiment of the present invention. Referring to Figure 9, one or more of the leached components 300 (Figure 3) have a. different actual leaching depth 920 than, at least one other leached component 300 (Figure 3). The leached component 300 (Figure 3) is the leached PDC cutter 300 (Figure 3) according to some exemplary embodiments; however, the leached component 300 can be only the PCD cutting table 310 (Figure 3) or some other component that has a polycrystalline structure that has •had at least some of the catalyst material removed from, therein. Alternatively, in certain exemplary embodiments, the leached component 300 (Figure 3) can be the chemically cleaned leached PDC cutter mentioned above.

[0053] The first calibration curve 905 is generated by obtaining two or more leached com onents .30(5 (Figure 3). The first calibration curve 905 becomes more precise as more leached components 300 (Figure 3) are used in generating the first calibration curve 905. The capacitance data points 930 are obtained by measuring the capacitance 910 of each leached ^' component 300 (figure 3). In certain exemplary embodiments,, a. -plurality, of capacitance data points 930 are obtained for each leached component 300 (Figure 3). For example, the capacitance 910 is measured five times for each leached component 300 (Figure 3). Obtaining a plurality of capacitance data points 930 for each leached component 300 (Figure 3} improves the statistical significance of the capacitance data points 930 being collected. According to some exemplar embodiments, the leached component 30Q (Figure 3} is depolarized after each measurement for capacitance 910, before each measurement for capacitance 10, or before and after each measurement for ^' capacitance 910. The leached component 300 (Figure 3) is depolarized in one of a combination of different manners, such as grounding the leached component 300 (Figure 3), wrapping the leached -component 300 (Figure 3) in aluminum foil or similar type material, heat treating the leached component _. 300 (Figure. 3), dropping the leached component 300 (Figure 3) in a salt solution, or waiting- to discharge the: leached component 300 (Figure 3). The leached component 300 (Figure 3} is discharged by waiting about twenty-four, hours, but the waiting time is greater or les in other exemplary embodiments. Depolarizing an object is known to people having ordinary skill in the art.

[0054] Once the capacitance 910 Is measured for each leached component 300

(Figure 3), the eddy cm-rent 1010 (Figure 10A), which is discussed in further detail below, is measured before determining the actual leaching depth 920 for each leached component 300 (Figure 3). However, in other exemplary embodiments, the actual leaching depth 920 is determined ^' before measuring the- eddy current 1 10 (Figure 1 A) and a different set of leached components 300 (Figure 3) are used when measuring the eddy current 1010 (Figure 10A) when generating a second calibration curve 1005 (Figure. IDA), which is discussed in further detail below. In some examples, the actual leaching depth 920 for a leached component 300 (Figure 3) is determined by cutting the leached component 300 (Figure 3), polishing the cut edge of the leached component 300 (Figure 3), and visually measuring the actual leaching depth 920 under a magnifying device (not shown), such as a microscope. Although one method for determining the actual leaching depth 920 is described, other methods known to people having ordinary skill in the art can be used to determine the actual leaching depth 920 without departing from the scope and spirit of the exemplary embodiment. Each capacitance data point 930 is plotted on the graphical chart 900, where the actual leaching depth 920 is plotted versus the capacitance- 910. that is measured. Once the capacitance data points 930 are plotted on the graphical chart 900, the first calibration curve 905 is determined, pursuant to methods known, to people. having ordinary skill in the art. For example, the first calibration curve _. 905 is generated by using the average capacitance 911 of each leached component 300, the median capacitance 912 of each leached component, or by calculating the best fit curve. The best fit curve can be formed with a ninety-five percent confidence -level, but this confidence level can range from about sixty percent to almost about one hundred percent, for example, 99.99 percent. The first calibration curve 905 correlates the measured capacitance 91.0, which can be measured in nanofarads, with the actual leaching depth 920, which can be measured in microns. Although a few methods for generating the first calibration curve 905 have been described, other methods, either destructive or non-destructive, can be used to generate the first calibration curve 905,

[0055] According to Figure 9, the actual leaching depth 920 is directly related to the capacitance 910, Thus, as the actual leaching depth 920 increases, the capacitance 910 that is measured also increases. Conversely, as the actual leaching depth 920 decreases, the capacitance 910 that is measured also decreases. Addiiionally, the data scattering, or range of measured capacitance 910, is greater as the actual leaching depth 920 increases. Although Figure 9 shows a direct relationship between the actual leaching depth 920 and the capacitance 910; in actuality, the relationship between the capacitance 910 and the actual leaching depth 920 is a inverse relationship. The formula to calculate the capacitance 910 is:

C = e _f (A/(4nd)} where

C is the capacitance;

A is the area of overlap of the two plates;

r is the relative static permittivity (sometimes called the dielectric constant); and

d is the separation between the plates.

Thus, as "d", or the actual leaching depth 920, increases, the capacitance 910 decreases, and visa versa. The opposite phenomena is occurring in Figure 9 because the by-product materials ^' 398 (Figure 3) present with the leached layer 354 (Figure 3) becomes polarized during the- measurements, and thus the relative static- permittivity is not constant.

[0056] Therefore, in certain exemplary embodiments, the leached layer 354

(Figure 3) is treated, such as. by chemical treatment, to have at least a portion of the by-product materials 398 (Figure 3) removed. This treatment is dependent upon the methods and/or chemicals used to -leach the PCD cutting table 310 (Figure 3). This treated leached PDC cutter is used within the capacitance measuring system 400, 500 (Figures 4 and 5„ respectively) or within some other capacitance measuring system in lieu of the leached PDC cutter 300 (Figure 3). The calibration curve that is determined using the treated leached PDC cutters would show the .relationship between the actual leaching, depth 920 and the capacitance 910 being an inverse relationship. In the methods using the treated leached PDC cutter,: which has had at least a portion of the by-product materials 398 ^' (Figure 3) removed, the de-polarizing step is optional.

[0057] Referring back to- Figure 8, the non-destructive leaching depth estimation method 800 proceeds to step 830. At step 830, a second calibration curve is obtained. The second calibration curve can be generated from tests or acquired, from elsewhere.

[0058] Figure 10 A is a graphical chart 1000 depicting the second calibration curve 1005 that shows a relationship between eddy current 1010 and actual leaching depth 920 for a plurality of leached components 300 (Figure. 3) in accordance- with an exemplary embodiment of the present invention, The eddy current 1010 is the. impedance amplitude 702 (Figures 7A-7C) in the exemplary embodiment shown in Figure 10 A. however, the phase angle shift 704 (Figures 7A-7C) can be used for the eddy current 1010 in lieu of the impedance amplitude 702 (Figures 7A-7C) in other exemplary embodiments. Referring to Figure 10A, one or more of the leached components 300 (Figure 3) have a different actual leaching depth. 920 than at least one other leached component 300 (Figure 3). In the exemplary embodiment shows, the leached components 300 (Figure 3) include shallow leached PDC cutters 705 and deep leached PDC cutters 755 of Figures 7A-7C. The leached component 300 (Figure 3) is the. leached ^' PDC cutter 300 (Figure 3) according to some exemplary .embodiments; however, the.- leached component 300 can be only the PCD cutting table 310 (Figure 3) or some other component that has a poiyerystalline -structure ^' that has had at least some of the catalyst material removed from therein. Alternatively, in ^• certain exemplary embodiments, the leached component 300 (Figure 3) can be the Chemically cleaned leached PDC cutter mentioned above. Tlierei re, in these alternative exemplary embodiments, the leached layer 354 (Figure 3) is treated, such as by chemical treatment, to have at least a portion of the by-product, materials 398 (Figure 3) removed. This treatment is dependent upon he methods and/or chemicals used to leach the PCD cutting table 310 (Figure 3). This treated leached PDC cutter is used within the eddy current testing system 600 (Figure 6) or within some other eddy current testing system in lieu of the leached PDC cutter 300 (Figure 3) in. accordance ^• with some exemplary embodiments. In the methods using the. treated, leached. PDC cutter, -which has had at least a portion of the by-product materials 398 (Figure 3) removed, the demagnetizing step is optional.

[0059] ^' Ore second calibration curve 1005 is generated by obtaining two or more leached components 300 (Figure 3). The second calibration curve 1005 becomes more precise as more leached components 300 (Figure 3) are used in generating the second calibration curve 1005. The. eddy current data points 1030 are obtained by measuring the eddy current 1010, either the impedance amplitude 702 (Figures 7A-7C) and/or the phase angle shift 704 (Figures 7A-7C), of each leached component 300 (Figure 3), in certain exemplary embodiments, a plurality of eddy current dat points 1030 are obtained for each leached component 300 (Figure 3). which has been illustrated in Figures 7A-7C. For example, the eddy current 1010 is- measured, three times for each leached component 300 (Figure 3), Obtaining a plurality of eddy current data points 1030 for eac leached component 300 (Ingure 3) improves the statistical significance of the eddy current data points 1030 being collected. According to some .exemplary embodiments, the leached component 300 (Figure 3) is demagnetized after each measurement for eddy current 1010, before each measurement for eddy current 1010, or before and after each measurement for eddy current 1010. The leached component 300 (Figure 3) is demagnetized in one or a combination of different manners, such as heating the cutters above the curie temperature of the catalyst, or cobalt, which is about Π 15 ^¾ C, running the cutters through an alternating current field, .grounding the leached component 300 (Figure 3), wrapping the leached, component 300 (Figure 3) in aluminum foil or similar type materia!, dropping the. leached component 300 (Figure 3) in a salt solution, or waiting a period of time to discharge the leached component 300 (Figure 3), The leached component 300 (Figure 3) is demagnetized by waiting about twenty-four hours, but the waiting time is greate o less in other exemplary embodiments. Methods fo demagnetizing an bject is known to people having ordinary sk ll in the art.

[0060] Once the eddy ^' current 1010 is measured for each leached component

300 (Figure 3), the actual leaching depth 920 for each leached component 300 (Figure 3) is determined. In some examples, the actual ^' .leaching depth 920 for a leached, component 300 (Figure 3} is determined by cutting- the leached component 300 (Figure 3), polishing the cut edge of the leached component 300 (Figure 3), and visually measuring the actual teaching depth 720 under a magnifying device (not shown), such as a microscope. Although one method for determining the actual, leaching depth 920 is described, other methods known to people having ordinary skill in the art can be used to determine the actual leaching depth 920 without departing from the scope and spirit of the exemplary embodiment. Each, eddy current data point 1030 is plotted on the graphical chart 1 00, where the actual leaching depth 920 is plotted versus the eddy current 1010 that is measured. In Figure 10A, the eddy current 1010 that is measured is the impedance amplitude 702 (Figures 7A-7C). Once the eddy current data points 1030 are plotted on the graphical chart 1000, the second calibration curve 1005 is determined pursuant to methods known to people having ordinary skill in the art. For example, the second calibration curve 1005 is generated by using the average eddy current of each leached component 300 (Figure 3), the median eddy current of each leached component 300 (Figure 3), or by calculating the best fit curve. The best fit curve can be formed with a ninety-five percent confidence level, but this confidence level can range from about sixty percent to almost about one hundred percent, for example. 99.99 percent.

[0061] In Figure 10 A, an _. upper 95% confidence line 1.042 and a lower 95% confidence line 1044 are illustrated, above and below the second calibration curve 1005. These upper 95% confidence line 1042 and lower 95% confidence line 1044 provide a range for estimating the actual leaching depth 920 from the measured edd current 1010 at a 95% confidence level, which is discussed in further detail with, respect to Figure 10B below. The second calibration curve 1005 correlates the measured eddy current 1010 with the actual leaching depth ^' 920, which can be .measured in microns. Although.. a few methods for generating the second calibration curve 1005 have been described, other methods, _, eithe -destructive or non-destructive, can be used to generate the -second calibration curve 1.005.

[0062] According, to Figure 10A, the actual leaching depth 920 is directly related, to the impedance amplitude 702 (Figure 7 A), which is labeled as eddy current 1.010 in Figure 10 A. Thus, as the actual leaching depth 920 increases, the eddy current 1,010, or impedance amplitude 702 (Figure 7A), that is measured also increases. Conversely, as the actual leaching depth 920 decreases, the eddy current 1010, or impedance anipl ^' itude 702 (Figure 7A), thai is measured also decreases. Although ^' a direct relationship exists between the actual leaching depth 920 and the impedance amplitude 70.2 (Figure 7A), conversely, an indirect relationship exists between the actual leaching depth 920 and the phase, angle shift 704 (Figure 7A).

[0063] Referring back to Figure 8, the non-destructive leaching depth estimation method 800 proceeds to step 840. At step 840, a similar type component, similar to leached cutter 300 (Figure 3), is obtained. However, if the first and second calibration curves -905, 1005 (Figures 9 and 10, respectively) were determined using treated leached PDC cutters, the similar type component is a different treated leached PDC cutter where the actual leaching depth is desired to be ascertained. This simila ^■ type component includes a polycrystalline structure that has a plurality of catalyst material therein. At least a portion of this cataiyst material has been removed. This removed portion has an unknown depth, which is the leaching depth.

[0064] The nondestructive leaching depth estimation method 800 proceeds to step 850. At step 850, the capacitance of the similar type component is measured. According to some exemplary embodiment, this capacitance is measured using the capacitance measuring system 400 (Figure 4) or the capacitance measuring system 500 fFigure 5).

[0065) The on-destmctive leaching depth estimation method 800 proceeds to step- 860. At. step 86.0, the eddy current, of the similar type .component is measured. According to some exemplary embodiments, this eddy current, is measured using the eddy current testing system 600 (Figure 6), wherein the impedance amplitude and/or the phase angle shift is obtained.

[0066] The non-destructive leaching depth estimation method 800 proceeds to step 870. At step 870, a first estimated leaching depth of the ^• similar type component is determined using at leas one capacitance value of the similar type component and the: first calibration curve 905 (Figure 9). The -first estimated leaching- depth is an estimation of the actual leaching depth and ranges from about one micron to about fifty microns from the .actual leaching depth according to some exemplary em bodi m en is ,

[0067] The non-destructive leaching depth estimation method 800 proceeds to step 880. A step 880, a second estimated, leaching depth of the similar type component is determined using at least one eddy current value of the similar type component and the second calibration curve 1005 (Figure 10A). The second estimated leaching depth is an estimation of the actual leaching depth and ranges from about one micron to about fifty microns from the actual leaching depth according to some exemplary embodiments.

[0068] Figure 10B is a partial view of the graphical chart 1000 of Figure 10A in accordance with an exemplary embodiment- of the present invention. Referring to Figure I0B, the eddy current 10.10 measured with the similar type component is fifty- live according to one exemplary embodiment. The actual leaching depth 920 is obtained by finding a point 1060 along the second calibration curve 1005 where the eddy current 101.0 is fifty-five. Thus, when the eddy current 1010 is fifty-five, it is determined that the actual leaching dept 920 for the similar type component is seventy microns. Using the upper and lower 95% confidence lines 1042 arid 1044, it is determined that the actual leaching depth 920 ranges, from about fifty microns to about ninety microns at a 95% confide ce level

[0069] Referring back to Figure 8. the nan-destructive leaching depth estimation method 800 proceeds to step 890. At step 890, mi overall! estimated leaching depth of the simila type component is determined "using the .first estimated leaching depth and the second estimated leaching depth. According to some exemplar)' embodiments, the overall estimated leaching depth is determined by averaging the first estimated leaching depth and the second estimated leaching depth. According to another exemplary embodiment, the overall estimated leaching depth, is determined by multiplying the first estimated leaching depth with a first multiplier factor and the second estimated leaching depth with a second multiplier factor. According to some exemplary embodiments, these first, and second multiplier factors are determined by _. calculating a best fit curve using the first estimated leaching depth, the second estimated leaching depth, and the actual leaching depth as known to people having ordinary skill in the art having the benefit of the present disclosure. The nondestructive leaching depth estimation method S0Q then proceeds to step 895, where the non-destructive leaching depth estimation method 800 ends. As previously mentioned, although the eddy current .measurement used, in the exemplary embodiment is the impedance amplitude, the phase angle shift can he used as the eddy current measurement in other exemplary embodiments.

[0070] Figure 11 Is a flowchart depicting a mierostructural quality determination method 1 1.00 in. accordance with an exemplary embodiment of the present invention. Although Figure 1 1 shows a series of steps depicted in certain order, the order of one or more steps can be rearranged, combined into fewer steps, and/or separated into more steps than thai shown in other exemplary embodiments. Referring to Figure 11, the mierostructural quality determination method 1100 begins at step 1110. Upon starting at step 1 1. 10, the mierostructural quality determination method 1 100 proceeds to step 1120. At step 120, one or more leached components that include a polycrv stall ine structure is obtained from, same leached batch. The same leached batch is a group of components that were leached in the same leaching process at the same time. The poiycrysta!Hne structure includes a leached layer and a non-!eaehed layer being positioned adjacently below the leached layer. The non- leached layer includes a plurality of catalyst material therein, while the leached layer has had at least a portion of the catalyst material removed.

[0071] The nucrostructurai quality determination method 1 100 proceeds to step 1 130, At step 1 130, a plurality of capacitance values are measured for each of the leached components. The capacitance values are determined using the capacitance measuring system 400 (Figure 4) or the capacitance measuring system 500 (Figure 5).

0072] The microstructural quality determination method 1 100 proceeds to step 1140. At step 140. a plurality of eddy current values are measured for each, of the leached components. The eddy current values are determined using the eddy current testing system 600 (Figure 6). The eddy current value measured, is the impedance amplitude in some exemplary embodiments; however, in other exemplary embodiments, the phase angle shift is the measured eddy current value.

[0073] The microstructural quality determination method 1100 proceeds to step 1 150, At step 1 150, a first amount of data scattering is determined based Upon the plurality of capacitance values for each of the leached components. The first amount of data scattering for a .leached component is determined by a differential between the highest measured capacitance and the lowest measured capacitance for that leached component and by statistical results of where each measured capacitance lies.

[0074] The microstructural quality determination method 1 100 proceeds to step 1160. At step 1 1 0, a second amount of data scattering is determined based upon the plurality of eddy current values for each of the leached components. The second amount of data scattering for a leached component is determined by a differential between the highest measured eddy current value and the lowest measured eddy current value for that leached component and by statistical results of where each measured eddy current value lies. As previously mentioned, the eddy current value is at least one of the impedance amplitude and the phase angle shift.

[0075] The microstructural quality determination method 1 100 proceeds to step 1170. At step 1 170, a first quality of the leached component is determined based upon the first amoun of data scattering. The first quality of the leached component relates to the raicrostructura! quality and/or the leaching quality. The mierostruetural quality relates to the porosity of the microstructure. The microstrucfurai quality is a good quality when there is low porosity. Conversely, the mierostruetural quality is a poor quality when there is high porosity. The leaching quality is a good, quality when there is less catalyst materials present within the leached layer of the polycrystaUme structure. Conversely, the leaching quality is a poor quality when there is more catalyst materials present within the leached layer of the polycrystalline structure, in some exemplary embodiments, the .first quality of the leached component is considered to be good when the first amount of data scattering is determined to be. small. Conversely, the first quality of the leached component is considered to be poor when the first amount of data scattering is determined to be large. The relative terms of small and large are determined when comparing the first amount of data scattering of a first leached component to the first amount of data scattering of a second leached component that was leached in the same batch as the first leached component

[0076] Figure 12 is a data scattering chart 1200 thai shows the measured capacitance 910 for- a plurality of leached cutters 1222 from a same leaching batch in accordance with an exemplary embodiment, of the present invention. Referring to Figure 12, the data scattering chart 1200 includes a cutter, number axis 1220 and a capacitance axis 1210. The cutter number axis 1220 includes the number of the cutters 1222 tested. The capacitance axis 1210 includes values for the measured capacitance 910. A capacitance data point 1230 is obtained by measuring the capacitance of the cutter 1222, or leached component 1222. using the capacitance measuring system 400 (Figure 4), the capacitance measuring system 500 (Figure 5), or a similar type system. Each capacitance data point 1230 is plotted on the data scattering chart. 1200. Each leached component 1222 has its capacitance measured a plurality of times. In some exemplary embodiments, five capacitance data points 12.30 are obtained for each, leached component 1222, however, the number of measurements Is greater or fewer in oilier exemplar embodiments. In some exemplary embodiments, a twenty-five percentile marking 1250, a fifty percentile marking 1252 (or average), and a seventy-five percentile marking 1.254 is shown in. the chart 1200 for each leached component 1222,. The area between the twenty- five percentile marking 1250 and. the seventy-five percentile marking 1254 is shaded. The first amount of data scattering, is ascertained using this data scattering chart 1200 and can be one or more of a differential between the highest and lowest capacitance measurements 910 for each leached component 1222, a range between the twenty-five percentile marking 1250 and the seventy-five percentile marking 1254, or some similar observation made from the data scattering chart 1200.

[0077] According to Figure 12, cutter number 4 1223 and carter number 9

1224 have a larger first amount of data scattering than for example cutter number 6

1225 or cutter number 7 1226. Hence, cutter number 4 1223 and cutter number 9 1224 have a poor leaching quality and/or a poor -mierostructural quality within the polycrystaliine structure when compared to cutter number 6 1225 or cutter number 7 1226. The increase in amount of catalyst material within the polycrystaliine structure causes- this data scattering.

[0078] Referring back to Figure 1 1. the microstructurai quality determination method 1100 proceeds to step 118.0. At step 1 ISO, a second quality of the leached component, is determined based upon the second amount - of data scattering. The second quality of the- leached component relates to the microstructurai quality and/or the leaching quality. The microsimcfura! quality relates to the porosity of the micros ^' tructure. The microstructurai quality is a good quality when there is low porosity. Conversely, the microstructurai quali y is a poor quality when there i high porosity. The leaching quality is a good quality when there is less catalyst materials present within the leached layer of the polycrystaliine structure. Conversely, the. leaching quality is a. poor quality when there is more catalyst materials present within the leached layer of the polycrystaliine structure. In some exemplary embodiments, the second quality of the leached component is considered to be good when the second .amount of data scattering is determined to be small. Conversely, the second quality of the leached component is considered to be poor when the second amount of data scattering is determined to be large. The relative terms of small and large are determined when comparing the second amount of data scattering of a first leached component to the second amount of data scattering of a second leached component that was leached in the same batch as the first leached component. [0079] Referring back to Figure 1 OA, the second amount of data scattering is seen for both shallow leached PDC cutters 705 and deep leached PDC cutters 755. Shallow leached PDC cutlers 705 have less second amount of data scattering than deep leached PDC cutters 755. As shown, there are three out of ten shallow leached PDC cutters 70S that have eddy current values that fail outside of the range defined by the upper 95% confidence line 1042 and the lower 95% confidence line 1044, while there are six out of ten deep leached PDC cutters 755 that have eddy current values that fall outside of the range defined by the upper 95% confidence line 1042 and the lower 95% confidence line 1044, Hence, the shallow leached PDC .cutters ^' 705 have a better microstracturai quality and/or leaching, quality than the deep leached PDC cutters 755.

[0080] Referring back to Figure 1 1, the microsiructural quality determination method 1.100 proceeds to step 1 1 0. At- step 1 190, an overall quality of the leached component is determined based upon the first quality and the second quality. According to some exemplary embodiments, the overall quality is good when .the results of the first quality and the second qualit -are- both good. The overall quality is average when the results of one of the first quality and the second quality is good and the results of the other is poor. The overall quality is poor when the result s of the first qualify and the second quality are both. poor. The microsiructural quality determination method 1 100 then proceeds to step 1195, where the mierostruct ral quality determination, method 1100 ends. As previously mentioned, although the eddy current measurement used in the exemplary embodiment is the impedance amplitude, the phase angle shift can be used as the eddy current measurement in other exemplary embodiments.

[0081 ] According to some exemplar embodiments, the combined use of the capacitance and eddy current measuring techniques help reduce the statistical noise, thereby providing a belter resolution. In certain examples, the resolution is about plus minus five to ten microns, but the .range is different in other exemplary embodiments. Combining the two techniques also help in separating the effect of the residual, metal binder from the effect of the leaching depth. The two techniques are not used at the same time; but instead, are used sequentially. In certain exemplary embodiments, the capacitance measuring technique is used prior to the eddy current measuring technique; however, in other exemplary embodiments, the eddy current measuring technique is used prior to Hie capacitance measuring technique.

[0082] There are several benefits for non-destrucriveiy determining the leaching depth in an ultra-hard poi crystal line structure and/or characterizing at least a portion of the ultra-hard polycrystailine structure. For example, eddy current measurements and/or capacitance measurements can he made on all PDC cutters that are to be mounted a d used in a tool, such as a drill bit, thereby being able to estimate the leaching depth in the ultra-hard polycrystailine structure included in the PDC cutter and/or characterizing at least a portion of the ultra-hard polycrystailine structure, such as the quality of the leaching and/or the quality of the microstrucmre.. Hence, only certain PDC cutters are chosen to be mounted to the drill bit or other downhoie tool. In another -example, when a quantity of PDC cutters being leached within the same leaching batch are provided, such as one thousand PDC cutters, the eddy current and/or capacitance of the PDC cutters are measured pursuant to the descriptions provided above. The PDC cutters ^' that meet, a desired quality and/or leaching depth are kept while the remaining PDC cutters that do not meet the desired leaching depth and/or quality are. returned. Thus, in one exemplary embodiment, although ope thousand PDC cutters being leached from the same hatch are provided, two hundred PDC cutters, or twenty percent may be retained while the remaining are returned. Thus, only the higher quality and/or the proper leaching depth PDC cutters are paid for and retained, which results in the PDC cutters performing better during their application.

[0083] Although each exemplary embodiment has been described in detail, it is to be construed that any features and modifications that are applicable to one embodiment are also applicable to the other embodiments. Furthermore, although the invention has been described with reference to specific embodiments, these descriptions are not meant to be. construed in a limiting sense. Various modifications of the disclosed embodiments, as well as alternative embodiments of the invention will become apparent to persons of ordinary skill in the art upon reference to the description of the exemplary embodiments. It should be appreciated by those of ordinary skill in the art thai the conception and the specific embodiments disclosed may be readily utilized as a basis for modifying or designing other structures or methods for carrying out the same purposes of the invention. It should also be realized by those of ordinary skill in the art that such equivalent constructions do not depart from the spirit and scope of the invention as set forth in the appended claims. It is therefore, contemplated thai the claims will cover any such modifications or embodiments- that fail within the scope of the invention.