Title:
UV-CURABLE ADHESIVE COMPOSITION, CURED PRODUCT THEREOF, AND METHOD FOR MANUFACTURING OPTICAL MEMBER EMPLOYING UV-CURABLE ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/069872
Kind Code:
A1
Abstract:
Provided is (1) a UV-curable adhesive composition that is a resin composition used to bond at least two optical substrates with each other, and that contains an intramolecular-hydrogen-abstracting photopolymerization initiator (A), a photopolymerizable oligomer (B), and a (meth)acrylate monomer (C), wherein the proportion at which a solvent is contained in the resin composition is equal to or less than 5 wt%, the weight average molecular weight of the photopolymerizable oligomer (B) falls within a range of 7000 to 100000, and the transmittance of a cured product of the resin composition for light in a wavelength range of 450 to 800 nm is equal to or greater than 85%.
Inventors:
MOTOHASHI HAYATO (JP)
NAITOU NOBUHIKO (JP)
UEHARA MICHIKO (JP)
NAITOU NOBUHIKO (JP)
UEHARA MICHIKO (JP)
Application Number:
PCT/JP2018/036748
Publication Date:
April 11, 2019
Filing Date:
October 01, 2018
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C09J4/02; C08F2/48; C09J5/00; C09J11/06; C09J11/08
Domestic Patent References:
WO2015190563A1 | 2015-12-17 | |||
WO2018104074A1 | 2018-06-14 |
Foreign References:
JP2012201786A | 2012-10-22 | |||
JP2016199656A | 2016-12-01 | |||
JP2009024160A | 2009-02-05 | |||
US20120172484A1 | 2012-07-05 | |||
JP2016121293A | 2016-07-07 | |||
JP2015165028A | 2015-09-17 | |||
JP2018109102A | 2018-07-12 |
Attorney, Agent or Firm:
SHIN-EI PATENT FIRM, P.C. (JP)
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