UV EPOXY RESIN INSTILLATION FORMING METHOD AND APPLICATION THEREOF

Title:

UV EPOXY RESIN INSTILLATION FORMING METHOD AND APPLICATION THEREOF

Document Type and Number:

WIPO Patent Application WO/2016/070722

Kind Code:

A1

Abstract:

Disclosed is a UV epoxy resin instillation forming method, which comprises the following steps: UV epoxy resin preparation: adding at least two photosensitizers into a single-component epoxy resin and uniformly mixing to obtain a UV epoxy resin, wherein the photosensitizer with the highest content in the UV epoxy resin is a photosensitive curing agent that is used for curing the UV epoxy resin, and the rest of the photosensitizer is a photosensitive viscosity regulator that is used for regulating the UV epoxy resin to the viscosity required by instillation forming; instillation: dividing the instillation of the UV epoxy resin into N procedures performed in one work station, wherein zero, one or more photosensitive viscosity regulators are correspondingly initiated in each procedure and used for regulating the UV epoxy resin to the viscosity required by the procedure and performing instillation; and curing: initiating the photosensitive curing agent to finally cure the UV epoxy resin. The method can be used in the fields of micro-electronic chip packaging, 3D printing and the like.

Inventors:

ZHOU ZONGTAO (CN)
HUANG CHENGSHENG (CN)

Application Number:

PCT/CN2015/092612

Publication Date:

May 12, 2016

Filing Date:

October 23, 2015

Export Citation:

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Assignee:

ZHOU ZONGTAO (CN)

International Classes:

C08J3/28; C08G59/40; C08J3/24; C08L63/00; C09J163/00; H01L21/56; H01L23/28

Foreign References:

US20070235127A1	2007-10-11
CN104387601A	2015-03-04
CN1156329A	1997-08-06
JPS62226634A	1987-10-05
CN101202252A	2008-06-18

Other References: