Title:
VACUUM FORMING MOLD ASSEMBLY AND ASSOCIATED METHODS
Document Type and Number:
WIPO Patent Application WO/2019/103827
Kind Code:
A3
Abstract:
The present disclosure is directed to a method for creating a vacuum forming mold assembly. The method includes forming a plurality of support plates. Each support plate includes a surface defining a shape corresponding to a cross-section of at least a portion of the mold cavity. The method also includes removably coupling a mold body to the plurality of support plates to form the mold assembly. The mold body conforms to the shape of the surface of each support plate after being removably coupled to the plurality of support plates such that the mold body defines at least a portion of a mold cavity of the mold assembly. The mold body defines at least one of one or more vacuum manifolds or one or more fluid passages.
Inventors:
TOBIN JAMES (US)
AYYASAMY BOOBALAN (US)
MCCALIP ANDREW (US)
AYYASAMY BOOBALAN (US)
MCCALIP ANDREW (US)
Application Number:
PCT/US2018/059154
Publication Date:
August 08, 2019
Filing Date:
November 05, 2018
Export Citation:
Assignee:
GEN ELECTRIC (US)
International Classes:
B29C51/34; B29C51/10; F03D1/06
Foreign References:
| US20170225362A1 | 2017-08-10 | |||
| EP0435446A2 | 1991-07-03 | |||
| CN204488065U | 2015-07-22 | |||
| JP2012158151A | 2012-08-23 | |||
| CN104955278A | 2015-09-30 |
Other References:
See also references of EP 3713734A4
Attorney, Agent or Firm:
ZHANG, Douglas, D. et al. (US)
Download PDF: