Title:
VACUUM FORMING MOLD ASSEMBLY AND METHOD FOR CREATING A VACUUM FORMING MOLD ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2019/103826
Kind Code:
A3
Abstract:
The present disclosure is directed to a mold assembly for vacuum forming a component. The mold assembly includes plurality of support plates and a plurality of mold plates removably coupled to the plurality of support plates. The plurality of mold plates is stacked and removably coupled together to form a mold configured for forming the component. Each mold plate including a first surface partially defining a top surface of the mold, a second surface spaced apart from the first surface, a third surface extending from the first surface to the second surface, and a fourth surface spaced apart from the third surface and extending from the first surface to the second surface.
Inventors:
TOBIN JAMES (US)
AYYASAMY BOOBALAN (US)
AYYASAMY BOOBALAN (US)
Application Number:
PCT/US2018/059141
Publication Date:
July 18, 2019
Filing Date:
November 05, 2018
Export Citation:
Assignee:
GEN ELECTRIC (US)
International Classes:
B29C51/08; B29C51/36; B29C51/10; B29C65/48; F03D1/06
Foreign References:
EP0435446A2 | 1991-07-03 | |||
JP2012158151A | 2012-08-23 | |||
CN204488065U | 2015-07-22 | |||
JP2000317972A | 2000-11-21 | |||
US20110266721A1 | 2011-11-03 |
Other References:
See also references of EP 3713735A4
Attorney, Agent or Firm:
BONDURA, Stephen, E. et al. (US)
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