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Patent Searching and Data


Title:
VACUUM FORMING MOLD ASSEMBLY AND RELATED METHODS OF USE
Document Type and Number:
WIPO Patent Application WO/2019/103825
Kind Code:
A3
Abstract:
The present disclosure is directed to a system for vacuum forming a component. The system includes a base and a plurality of mold segments positioned on the base. The plurality of mold segments are removably coupled together to define a mold cavity configured for forming the component. The base and one or more of the plurality of the mold segments collectively define a corresponding vacuum chamber of a plurality of vacuum chambers of the system. At least one of vacuum chambers is fluidly isolated from the other vacuum chambers. One or more of the plurality of the mold segments further define a plurality of vacuum passages fluidly coupling the mold cavity and the corresponding vacuum chamber.

Inventors:
TOBIN, James, Robert (300 Garlington Road, Greenville, SC, 29615, US)
Application Number:
US2018/059136
Publication Date:
July 18, 2019
Filing Date:
November 05, 2018
Export Citation:
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Assignee:
GENERAL ELECTRIC COMPANY (1 River Road, Schenectady, NY, 12345, US)
International Classes:
B29C51/36; B29C51/08; B29C51/10; B29C51/46; F03D1/06
Foreign References:
EP0435446A21991-07-03
JP2012158151A2012-08-23
CN204488065U2015-07-22
CN104955278A2015-09-30
US20110266721A12011-11-03
Attorney, Agent or Firm:
BONDURA, Stephen, E. et al. (Dority & Manning, P.A.P.O. Box 144, Greenville SC, 29602, US)
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