Title:
VACUUM-PRINTING CONDUCTIVE PASTE
Document Type and Number:
WIPO Patent Application WO/2020/003765
Kind Code:
A1
Abstract:
Provided is a vacuum-printing conductive paste as described below. With a vacuum-printing conductive paste according to the present invention, in a reduced-pressure atmosphere during vacuum printing, a solvent is not easily volatilized, and an increase in the viscosity of the conductive paste is suppressed, thus making it possible to maintain favorable printing performance during vacuum printing. Furthermore, during heating and curing, the solvent is sufficiently volatilized, achieving excellent adhesiveness to a printed material. The vacuum-printing conductive paste contains (A) a conductive filler, (B) a thermosetting resin, (C) a curing agent, and (D) a solvent having a vapor pressure of 0.8-15 Pa at 20°C.
Inventors:
TAKAHASHI TOMOYUKI (JP)
TSUBURA HIRONOBU (JP)
SAKAI NORIYUKI (JP)
ABE SHINICHI (JP)
TSUBURA HIRONOBU (JP)
SAKAI NORIYUKI (JP)
ABE SHINICHI (JP)
Application Number:
PCT/JP2019/018772
Publication Date:
January 02, 2020
Filing Date:
May 10, 2019
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
H01B1/22; C09D11/52; H01B1/00; H05K1/09; H05K3/12
Domestic Patent References:
| WO2013147235A1 | 2013-10-03 |
Foreign References:
| JP2005159344A | 2005-06-16 | |||
| JP2002203428A | 2002-07-19 | |||
| JP2017228363A | 2017-12-28 |
Attorney, Agent or Firm:
IAT WORLD PATENT LAW FIRM (JP)
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