Title:
VACUUM PUMP AND COVER USED FOR SAID VACUUM PUMP
Document Type and Number:
WIPO Patent Application WO/2022/181464
Kind Code:
A1
Abstract:
[Problem] To provide a vacuum pump capable of preventing entry of foreign matter such as particles caused by processing gas during processes and the like for manufacturing a semiconductor wafer. [Solution] The present invention comprises: a casing 127 having an air intake port 101; and a rotating body 103 that has a recess 201 open toward the air intake port 101, and that is fastened to a rotor shaft 113 by a fastening bolt 205 disposed in the recess 201. The present invention further comprises a cover 202 that has an outer circumferential portion 202b in contact with an upper end surface 103a of the rotating body 103 opposing the air intake port 101, that is formed so as to protrude toward the air intake port 101, and that covers the recess 201.
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Inventors:
KABASAWA TAKASHI (JP)
Application Number:
PCT/JP2022/006558
Publication Date:
September 01, 2022
Filing Date:
February 18, 2022
Export Citation:
Assignee:
EDWARDS JAPAN LTD (JP)
International Classes:
F04D19/04
Foreign References:
| US20140271174A1 | 2014-09-18 | |||
| JP2014055574A | 2014-03-27 | |||
| JPS53165968U | 1978-12-26 | |||
| JPH1061527A | 1998-03-03 |
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