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Title:
VACUUM REACTING FORCE WELDING METHOD AND DEVICE THEREOF
Document Type and Number:
WIPO Patent Application WO/2017/049511
Kind Code:
A1
Abstract:
A vacuum reacting force welding method, comprising the following steps: a chip being die-bonded onto a substrate by means of a solder to form a semi-finished product (16); the semi-finished product being placed within a vacuum eutectic cavity (6) of a vacuum eutectic stove; vacuum-pumping the vacuum eutectic cavity; preheating the vacuum eutectic cavity to slowly increase the temperature; heating the vacuum eutectic cavity quickly to melt the solder; applying an acting force to the vacuum eutectic cavity to raise the vacuum eutectic cavity acceleratedly after lowering same; performing forced refrigeration to the exterior of the vacuum eutectic cavity, while introducing a protective gas to the interior thereof; releasing the vacuum state of the vacuum eutectic cavity after the solder is solidified. Also disclosed is a welding device using the vacuum reacting force welding method. The welding method and device can apply, under the precondition of avoiding damage to the chip, a reacting force with acceleration to the chip, effectively lowering the voidage of the welding spot.

Inventors:
SU JIABING (CN)
QIN MINGCHAO (CN)
Application Number:
PCT/CN2015/090464
Publication Date:
March 30, 2017
Filing Date:
September 23, 2015
Export Citation:
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Assignee:
GUANGZHOU LEDTEEN OPTOELECTRONICS CO LTD (CN)
International Classes:
B23K1/008; B23K3/00
Foreign References:
US5046656A1991-09-10
EP0795891A21997-09-17
US5632434A1997-05-27
CN102528194A2012-07-04
CN103229604A2013-07-31
Attorney, Agent or Firm:
GUANGZHOU YUEXIU JILY PATENT & TRADEMARK LAW OFFICE (CN)
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