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Title:
VACUUM THERMAL INSULATION MATERIAL AND DEVICE USING THE SAME
Document Type and Number:
WIPO Patent Application WO/2004/094891
Kind Code:
A1
Abstract:
A vacuum thermal insulation material, wherein the thermally fused layer of a covering material in laminated structure is formed of a film with a melting point of 200 ºC or higher, or the thermally fused layer is formed of a film with a melting point of 100 to 200 ºC and fin parts are bent to low temperature sides, whereby the lowering of gas-barrier properties can be suppressed even in a high temperature atmosphere of approx. 150 ºC. Accordingly, the heat insulating performance of the vacuum thermal insulation material can be maintained for a long period. The vacuum thermal insulation material is suitably used for devices having heat sources exceeding 100 ºC and heat-insulated parts.

Inventors:
TSUNETSUGU KEISUKE
NAKAMA HIROTO
Application Number:
PCT/JP2004/004395
Publication Date:
November 04, 2004
Filing Date:
March 29, 2004
Export Citation:
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Assignee:
MATSUSHITA ELECTRIC IND CO LTD (JP)
TSUNETSUGU KEISUKE
NAKAMA HIROTO
International Classes:
E04B1/80; G03G15/20; (IPC1-7): F16L59/06; G03G15/20; A47J41/00; A47J27/21
Foreign References:
JP2001141179A2001-05-25
JP2001265138A2001-09-28
JP2002048466A2002-02-15
JPH11280987A1999-10-15
JPH0464089U1992-06-01
JP2003074786A2003-03-12
JPH07269781A1995-10-20
Other References:
None
See also references of EP 1617126A4
Attorney, Agent or Firm:
Iwahashi, Fumio c/o Matsushita Electric Industrial Co. Ltd. (1006, Oaza Kadom, Kadoma-shi Osaka, JP)
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