Title:
VALVE DEVICE ASSEMBLY
Document Type and Number:
WIPO Patent Application WO/2022/215563
Kind Code:
A1
Abstract:
Provided is a valve device assembly that makes it possible to suppress heat exchange between valve devices. The valve device assembly (5) includes a high pressure-side valve device (10) and a low pressure-side valve device (20). Each of the high pressure-side valve device (10) and the low pressure-side valve device (20) includes: one valve body having a plurality of refrigerant passages; and a plurality of valve units mounted to the valve body. A high pressure-side valve body (100) of the high pressure-side valve device (10) and a low pressure-side valve body (200) of the low pressure-side valve device (20) are arranged separated from each other.
Inventors:
KAINUMA HIROSHI (JP)
MIYAMOTO KAZUHIRO (JP)
MIYAMOTO KAZUHIRO (JP)
Application Number:
PCT/JP2022/014738
Publication Date:
October 13, 2022
Filing Date:
March 25, 2022
Export Citation:
Assignee:
FUJIKOKI CORP (JP)
International Classes:
F16K27/00; F25B41/26
Foreign References:
| JPH0552437A | 1993-03-02 | |||
| JP2015061451A | 2015-03-30 | |||
| JPH04106376A | 1992-04-08 | |||
| JP2015077816A | 2015-04-23 | |||
| JP2016200198A | 2016-12-01 |
Attorney, Agent or Firm:
OPUS IP LAW FIRM (JP)
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