Title:
VAPOR CHAMBER HAVING POROUS FILLER PORTION FORMING GAS DIFFUSION PATH
Document Type and Number:
WIPO Patent Application WO/2024/080762
Kind Code:
A1
Abstract:
Disclosed is a vapor chamber having a porous filler portion forming a gas diffusion path. According to the present invention, the heat transmitted via a metal chamber housing quickly vaporizes a phase change liquid even at a relatively low temperature by using both a porous core layer forming a porous filler part therein and a structure of a diffusion space. Subsequently, moisture condensed in the form of water droplets due to a cooling action is quickly absorbed by the capillary phenomenon of the porous structure. As a result, a favorable environment for the circulation of vaporization and liquefaction is created, thereby ensuring improved performance of various electronic devices in terms of heat distribution and heat dissipation.
Inventors:
JOO HAK SIK (KR)
JOO SE HYUN (KR)
JOO SE HYUN (KR)
Application Number:
PCT/KR2023/015672
Publication Date:
April 18, 2024
Filing Date:
October 12, 2023
Export Citation:
Assignee:
JOO HAK SIK (KR)
JOO SE HYUN (KR)
JOO SE HYUN (KR)
International Classes:
H05K7/20; F28D15/02; F28F21/02; F28F21/08
Attorney, Agent or Firm:
OH, Seung Keon (KR)
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