Title:
VAPOR DEPOSITION EQUIPMENT AND METHOD FOR DEPOSITING THIN FILM
Document Type and Number:
WIPO Patent Application WO/2023/087205
Kind Code:
A1
Abstract:
Embodiments of the present application relate to the technical field of semiconductors, and provide vapor deposition equipment and a method for depositing a thin film, which can solve the problem that, when depositing a thin film by means of existing vapor deposition equipment, the thin film needing to be removed in the edge area of a part for deposition in the subsequent process is prone to remain, and becomes the source of various defects. The vapor deposition equipment comprises a housing, a base, a raw material placement table, an insulating shielding plate, and a shielding plate fixing frame. A closed cavity is formed in the housing, the base is located in the cavity, the base is provided with a bearing surface, and the bearing surface is used for bearing a part for deposition; the raw material placement table is located in the cavity and used for fixing a material for deposition; the insulating shielding plate is arranged between the base and the raw material placement table and is used for shielding the edge area of the part for deposition; the shielding plate fixing frame is connected to the insulating shielding plate and used for fixing the insulating shielding plate.
Inventors:
FAN RONGWEI (CN)
LIN JUN (CN)
LIN JUN (CN)
Application Number:
PCT/CN2021/131446
Publication Date:
May 25, 2023
Filing Date:
November 18, 2021
Export Citation:
Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
C23C14/35; C23C14/04
Foreign References:
| CN110670042A | 2020-01-10 | |||
| CN111041434A | 2020-04-21 | |||
| CN111254383A | 2020-06-09 | |||
| JP2006118004A | 2006-05-11 | |||
| TWM610249U | 2021-04-11 |
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