VAPOR DEPOSITION MASK, VAPOR DEPOSITION MASK PRECURSOR, VAPOR DEPOSITION MASK MANUFACTURING METHOD, AND ORGANIC SEMICONDUCTOR ELEMENT MANUFACTURING METHOD

WIPO Patent Application WO/2014/167989

A1

The purpose of the present invention is to provide: a vapor deposition mask, which is able to satisfy both increased detail and decreased weight even when size is increased and with which a highly detailed vapor deposition pattern can be formed even while strength is maintained; a vapor deposition mask manufacturing method and vapor deposition mask precursor with which said vapor deposition mask can be easily manufactured; and an organic semiconductor element manufacturing method capable of manufacturing highly detailed organic semiconductor elements. A metal mask (10) provided with multiple slits (15) is laminated on a resin mask (20). The resin mask (20) is provided with the openings (25) necessary for configuring multiple screens. The openings (25) correspond to the pattern to be manufactured by vapor deposition. Each slit (15) is provided at a position that overlaps at least one entire screen.

JPH09185850	PRODUCTION OF OPTICAL INFORMATION RECORDING MEDIUM AND APPARATUS FOR PRODUCTION THEREOF
JPH02197553	MASKING METHOD IN METAL COATING TREATMENT
JP4592261	Welding fixing method of metal mask

TAKEDA TOSHIHIKO (JP)
OBATA KATSUNARI (JP)
OCHIAI HIROMITSU (JP)

PCT/JP2014/058049

October 16, 2014

March 24, 2014

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DAINIPPON PRINTING CO LTD (JP)

C23C14/04; B23K26/00; H01L51/50; H05B33/10

JP2004043898A	2004-02-12
JP2010242141A	2010-10-28
JP2004190057A	2004-07-08
JPH07300664A	1995-11-14

INTECT INTERNATIONAL PATENT OFFICE et al. (JP)
Patent business corporation Intect International Patent Office (JP)

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