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Patent Searching and Data


Title:
VAPOR INJECTION MODULE AND HEAT PUMP SYSTEM USING SAME
Document Type and Number:
WIPO Patent Application WO/2021/172752
Kind Code:
A1
Abstract:
The present invention provides a vapor injection module including an inlet through which a refrigerant is introduced and a first line and a second line connected to the inlet so as to allow the introduced refrigerant to move, comprising: a first expansion means that is disposed at a connection part of the first line and the second line to control the movement direction and expansion of the refrigerant according to an air conditioning mode; a gas-liquid separator that is connected to the first line to separate the introduced refrigerant into a liquid-phase refrigerant and a gas-phase refrigerant; a second expansion means that is connected to a movement passage along which the liquid-phase refrigerant separated from the gas-liquid separator moves and expands the introduced refrigerant; and a first outlet connected to the second line and the second expansion means.

Inventors:
KIM SEONG HUN (KR)
LEE HAE JUN (KR)
LEE SUNG JE (KR)
Application Number:
PCT/KR2021/000519
Publication Date:
September 02, 2021
Filing Date:
January 14, 2021
Export Citation:
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Assignee:
HANON SYSTEMS (KR)
International Classes:
B60H1/00; B60H1/14; B60H1/32; F25B41/31; F25B41/385; F25B43/00
Foreign References:
KR101903140B12018-10-01
KR100500767B12005-07-12
US4881718A1989-11-21
KR20110119553A2011-11-02
JP2013092355A2013-05-16
Attorney, Agent or Firm:
DANA PATENT LAW FIRM (KR)
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