VARNISH CONTAINING POLYAMIDE RESIN AND USE THEREOF

Title:

VARNISH CONTAINING POLYAMIDE RESIN AND USE THEREOF

Document Type and Number:

WIPO Patent Application WO/2002/034850

Kind Code:

A1

Abstract:

A polyamide resin composition from which the solvent is easily removed during film formation and which gives a film or adhesive layer reduced in residual solvent content. It is suitable for use especially as a varnish. The composition and varnish are characterized by comprising as essential ingredients an aromatic polyamide resin having phenolic hydroxyl groups and a cycloalkanone as a solvent and preferably further containing a curable resin.

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Inventors:

IMAIZUMI MASAHIRO (JP)
ASANO TOYOFUMI (JP)
SHINMOTO MASAKI (JP)

Application Number:

PCT/JP2001/009130

Publication Date:

May 02, 2002

Filing Date:

October 18, 2001

Export Citation:

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Assignee:

NIPPON KAYAKU KK (JP)
IMAIZUMI MASAHIRO (JP)
ASANO TOYOFUMI (JP)
SHINMOTO MASAKI (JP)

International Classes:

C08G69/26; C09D153/00; C09D177/00; C09D177/06; C09D177/10; C09J7/02; C09J153/00; C09J177/00; C09J177/06; C09J177/10; H01L23/498; H05K1/03; (IPC1-7): C09D177/10; C08L63/00; C08L77/10; C08L81/02; C09D163/00; C09J163/00; C09J177/10; H01L23/12

Foreign References:

JPH08143661A	1996-06-04
JPH0931154A	1997-02-04
JPH04170431A	1992-06-18
JPH06299133A	1994-10-25
JPH08217959A	1996-08-27
EP0388243A1	1990-09-19

Other References: