Title:
VARNISH AND CURED BODY THEREOF
Document Type and Number:
WIPO Patent Application WO/2024/014436
Kind Code:
A1
Abstract:
Provided is a cured body having excellent low-dielectric properties, high elastic modulus at normal temperature and high temperatures, and a high cross-link density. Also provided is a varnish containing: a polymer compound that has a plurality of radical reactive functional groups per molecule, and has a number average molecular weight (Mn) of 500-12000; and a monomer component that is a liquid at room temperature, and has a radical reactive functional group in each molecule. The varnish is characterized in that: the monomer component includes a polyfunctional monomer, with the polyfunctional monomer content being 31-70 mass% of the total mass of the varnish; and the varnish includes substantially no solvent component.
Inventors:
ARAI TORU (JP)
Application Number:
PCT/JP2023/025492
Publication Date:
January 18, 2024
Filing Date:
July 10, 2023
Export Citation:
Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08F255/00; C08F290/12
Domestic Patent References:
| WO2018159080A1 | 2018-09-07 | |||
| WO2022054885A1 | 2022-03-17 | |||
| WO2021112087A1 | 2021-06-10 |
Foreign References:
| JP2010280860A | 2010-12-16 | |||
| JP2009161743A | 2009-07-23 |
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
Download PDF:
Previous Patent: CURABLE RESIN COMPOSITION, CURABLE FILM, AND LAMINATED FILM
Next Patent: CURABLE COMPOSITION, CURED PRODUCT, AND DENTAL MATERIAL
Next Patent: CURABLE COMPOSITION, CURED PRODUCT, AND DENTAL MATERIAL