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Patent Searching and Data


Title:
VARNISH, POROUS POLYIMIDE FILM PRODUCED USING SAID VARNISH, AND METHOD FOR PRODUCING SAID FILM
Document Type and Number:
WIPO Patent Application WO/2014/196435
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a production method which enables the production of a homogeneous and highly dense porous polyimide film and a separator equipped with the porous polyimide film by removing resin microparticles from a polyimide film containing the resin microparticles by thermal decomposition. A method for producing a porous polyimide film according to the present invention comprises: a baking step of baking an unbaked composite film comprising a polyamic acid or polyimide, resin microparticles and a condensing agent at a temperature that is lower than the decomposition temperature of the resin microparticles to produce a polyimide-(resin microparticle) composite film; and a microparticle removal step of removing the resin microparticles from the polyimide-(resin microparticle) composite film.

Inventors:
SUGAWARA TSUKASA (JP)
Application Number:
PCT/JP2014/064164
Publication Date:
December 11, 2014
Filing Date:
May 28, 2014
Export Citation:
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Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
C08J9/26; C08L79/08; H01M50/414; H01M50/423
Domestic Patent References:
WO2012169383A12012-12-13
Foreign References:
JP2010024385A2010-02-04
JP2010043134A2010-02-25
JP2003165905A2003-06-10
JP2011012207A2011-01-20
JP2004026954A2004-01-29
JP2002356577A2002-12-13
Attorney, Agent or Firm:
SHOBAYASHI, Masayuki (JP)
Right wood Masayuki (JP)
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