VASCULAR BUNDLE LIQUID FLOW RATE SENSOR AND METHOD FOR MANUFACTURING VASCULAR BUNDLE LIQUID FLOW RATE SENSOR

WIPO Patent Application WO/2018/168483

A1

The purpose of the present invention is to provide a vascular bundle liquid flow rate sensor that can be manufactured at a low cost while having dimensions at which the flow rate of a vascular bundle liquid in a stem of a plant or the like can be measured. This vascular bundle liquid flow rate sensor (1) includes a heater sensor (HS) and a reference sensor (RS). The heater sensor (HS) is provided with: a first probe part (10a) comprising a heat transfer plate (11) and a probe (12); a heater (20); a first temperature sensor (30a); and a first case (40a) accommodating therein the heat transfer plate (11), the heater (20), and the first temperature sensor (30a). The reference sensor (RS) is provided with: a second probe part (10b) comprising a heat transfer plate (11) and a probe (12); a second temperature sensor; and a second case (40b) accommodating therein the heat transfer plate (11) and the second temperature sensor (30b). Each of the first probe part (10a) and the second probe part (10b) is formed of a metallic material.

SHIMOKAWA FUSAO (JP)
NAKATA KYOSUKE (JP)
TAKAO HIDEKUNI (JP)
TERAO KYOHEI (JP)
YOSHIMURA HIDENORI (JP)
ISHIZUKA HIROKI (JP)
KOBAYASHI TSUYOSHI (JP)
KATAOKA IKUO (JP)

PCT/JP2018/007693

September 20, 2018

March 01, 2018

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UNIV KAGAWA NAT UNIV CORP (JP)

G01P5/12

JP2000146653A	2000-05-26
JP2015145810A	2015-08-13
US5269183A	1993-12-14
JPH05188070A	1993-07-27

YAMAUCHI PATENT ATTORNEYS (JP)

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