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Title:
VEHICLE-MOUNTED ELECTRONIC MODULE, CARD EDGE CONNECTOR, AND CONNECTOR
Document Type and Number:
WIPO Patent Application WO/2017/126283
Kind Code:
A1
Abstract:
Contacting portions of connection terminals made from non-noble metals have the problem that a high-temperature environment or fretting wear resulting from temperature cycling may cause an oxide film or high-resistance abrasion powder to form at the contact interface, increasing the contact resistance. The objective of the present invention is to provide a vehicle-mounted electronic module, a connector and a connecting structure for the same which have a similar connection reliability to that between precious metals, even if exposed to a harsh environment, and with which material costs can be reduced. This vehicle-mounted electronic module comprises a circuit board on which electronic components are mounted, and a protecting member which accommodates the circuit board to protect the same from the surrounding environment, wherein a surface layer of a terminal portion of the circuit board is an Ag-containing Sn-based solder having a mean thickness of 4 µm or more, and a surface material of a connection terminal of one card edge connector has a two-layer construction comprising a noble metal layer of soft Ag, Pd, Pt or the like and either a reaction layer of a hard noble metal and Sn or a Ni layer.

Inventors:
KAJIWARA RYOUICHI (JP)
ISHII TOSHIAKI (JP)
KAMOSHIDA MASARU (JP)
Application Number:
PCT/JP2016/088264
Publication Date:
July 27, 2017
Filing Date:
December 22, 2016
Export Citation:
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Assignee:
HITACHI AUTOMOTIVE SYSTEMS LTD (JP)
International Classes:
H05K1/11; H01R12/72; H01R13/03; H05K3/36
Foreign References:
JP2015125951A2015-07-06
JPH10247766A1998-09-14
JP2003068966A2003-03-07
JP2015222715A2015-12-10
Attorney, Agent or Firm:
TODA Yuji (JP)
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