Title:
VEHICLE
Document Type and Number:
WIPO Patent Application WO/2019/003437
Kind Code:
A1
Abstract:
In this motorcycle (10), a bonding area (80L, 80R) of a rear frame (34L, 34R) is bonded to a bonding surface (76L, 76R) formed on the lower part (36) of a main frame (32). In this case, the bonding surface (76L, 76R) is formed to extend to outside of the bonding area (80L, 80R) in a state in which the bonding surface (76L, 76R) is bonded to the bonding area (80L, 80R).
Inventors:
KAWANO SUNAO (JP)
Application Number:
PCT/JP2017/024220
Publication Date:
January 03, 2019
Filing Date:
June 30, 2017
Export Citation:
Assignee:
HONDA MOTOR CO LTD (JP)
International Classes:
B62K11/02; B62K19/02; B62K19/18; B62K25/00
Foreign References:
| JP2011230610A | 2011-11-17 | |||
| JPH0752838A | 1995-02-28 | |||
| JPS5929389U | 1984-02-23 | |||
| JPS6042181A | 1985-03-06 | |||
| JP2002096788A | 2002-04-02 | |||
| JP2005219616A | 2005-08-18 | |||
| JPS61238579A | 1986-10-23 |
Attorney, Agent or Firm:
CHIBA Yoshihiro et al. (JP)
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