Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
VEHICLE
Document Type and Number:
WIPO Patent Application WO/2019/003437
Kind Code:
A1
Abstract:
In this motorcycle (10), a bonding area (80L, 80R) of a rear frame (34L, 34R) is bonded to a bonding surface (76L, 76R) formed on the lower part (36) of a main frame (32). In this case, the bonding surface (76L, 76R) is formed to extend to outside of the bonding area (80L, 80R) in a state in which the bonding surface (76L, 76R) is bonded to the bonding area (80L, 80R).

Inventors:
KAWANO Sunao (4-1, Chuo 1-chome, Wako-sh, Saitama 93, 〒3510193, JP)
Application Number:
JP2017/024220
Publication Date:
January 03, 2019
Filing Date:
June 30, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HONDA MOTOR CO., LTD. (1-1 Minami-Aoyama 2-chome, Minato-ku Tokyo, 56, 〒1078556, JP)
International Classes:
B62K11/02; B62K19/02; B62K19/18; B62K25/00
Foreign References:
JP2011230610A2011-11-17
JPH0752838A1995-02-28
JPS5929389U1984-02-23
JPS6042181A1985-03-06
JP2002096788A2002-04-02
JP2005219616A2005-08-18
JPS61238579A1986-10-23
Attorney, Agent or Firm:
CHIBA Yoshihiro et al. (Shinjuku Maynds Tower 16F, 1-1 Yoyogi 2-chome, Shibuya-k, Tokyo 53, 〒1510053, JP)
Download PDF: