VEHICULAR CONDUCTIVE CIRCUIT MANUFACTURING METHOD

WIPO Patent Application WO/2024/043026

A1

Provided is a vehicular conductive circuit manufacturing method which makes it possible to form a wiring so as to have a cross section area is at a square millimeter level. This vehicular conductive circuit manufacturing method is for manufacturing a conductive circuit for a vehicle by forming, on a substrate (1), a wiring (3) composed of a conductor, the method comprising: a coating step for forming a conductive particle paste film (2) on the substrate (1) by coating the surface of the substrate (1) with a conductive particle paste that contains conductive particles (11), a binder, and a liquid medium; a curing step for curing the binder to modify the conductive particle paste film (2) to a porous layer (22) having the conductive particles (11) and a cured reactant (13) of the binder; a plating step for performing electroless plating by impregnating the porous layer (22) with an electroless liquid, and binding together the conductive particles (11) dispersed in the porous layer (22) by means of plating deposition metal deposited from the electroless plating liquid, thereby modifying the porous layer (22) to the wiring (3) composed of a conductor.

UCHIYAMA NORIKO (JP)
NAGAYAMA MORI (JP)
TAKEMOTO SHINICHIROU (JP)
IWASE TAKAKUNI (JP)
MIWA HIROTAKA (JP)
UEHARA YOSHITAKA (JP)
KOSEMURA TOORU (JP)

PCT/JP2023/028337

February 29, 2024

August 02, 2023

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NISSAN MOTOR (JP)

H05K3/18; H05K3/24

WO2020004624A1	2020-01-02
WO2005102709A1	2005-11-03
WO2014132961A1	2014-09-04

JP2016025329A	2016-02-08
JPH09293952A	1997-11-11
JP2001073157A	2001-03-21
JP2006332553A	2006-12-07
JP2011012312A	2011-01-20
JP2005302842A	2005-10-27

TANAKA Hidetetsu et al. (JP)

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