Title:
VIBRATING STRUCTURE, PANEL MODULE, AND HOUSING MODULE
Document Type and Number:
WIPO Patent Application WO/2023/120023
Kind Code:
A1
Abstract:
Provided is a vibrating structure that vibrates a panel having a main surface, the vibrating structure comprising an inner frame physically connected to the panel and a housing, an outer frame physically connected to the panel and the housing, and a vibrating body that vibrates the panel, wherein the inner frame is surrounded by the outer frame as seen in the normal direction of the main surface, the inner frame has a first portion that overlaps the housing as seen in the normal direction, the outer frame has a second portion that overlaps the panel as seen in the normal direction, and the vibrating structure has the following structure (A) or (B). (A) The vibrating body is mounted to the panel or the inner frame. (B) The vibrating body is mounted across the panel or the inner frame and the housing or the outer frame.
Inventors:
OTERA SHOZO (JP)
ENDO JUN (JP)
ISHIURA YUTAKA (JP)
ENDO JUN (JP)
ISHIURA YUTAKA (JP)
Application Number:
PCT/JP2022/043452
Publication Date:
June 29, 2023
Filing Date:
November 25, 2022
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
G06F3/041; G06F3/01
Domestic Patent References:
| WO2012111351A1 | 2012-08-23 | |||
| WO2021177268A1 | 2021-09-10 |
Foreign References:
| JP2012068823A | 2012-04-05 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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