Title:
VIBRATION ASSEMBLY AND MANUFACTURING METHOD THEREFOR, BONE VOICEPRINT SENSOR, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/142762
Kind Code:
A1
Abstract:
Disclosed are a vibration assembly and a manufacturing method therefor, a bone voiceprint sensor, and an electronic device. The method comprises: preparing a first diaphragm ring and a mass block, the mass block being provided with a pressure equalizing hole; fixing the first diaphragm ring and the mass block to a first diaphragm; and providing an air hole in an area of the first diaphragm covering the pressure equalizing hole. Before the first diaphragm ring and the mass block are fixed to the first diaphragm, the pressure equalizing hole has been provided in the mass block, so that when an air hole is provided in the area of the first diaphragm covering the pressure equalizing hole, it is only necessary to provide an air hole on the first diaphragm, and it is not necessary to use a high-energy laser to penetrate the mass block to form a pressure equalizing hole, thereby avoiding formation of a bulge and avoiding the problem of a fixing failure of the mass block and the first diaphragm, and improving the product quality of the vibration assembly.
Inventors:
PEI ZHENWEI (CN)
DUANMU LUYU (CN)
DUANMU LUYU (CN)
Application Number:
PCT/CN2022/139534
Publication Date:
August 03, 2023
Filing Date:
December 16, 2022
Export Citation:
Assignee:
QINGDAO GOERTEK INTELLIGENT SENSOR CO LTD (CN)
International Classes:
H04R9/08; H04R9/02; H04R31/00
Foreign References:
| CN114501252A | 2022-05-13 | |||
| CN113259795A | 2021-08-13 | |||
| CN113923581A | 2022-01-11 | |||
| CN201210744Y | 2009-03-18 | |||
| CN113411731A | 2021-09-17 | |||
| CN102932718A | 2013-02-13 | |||
| CN202602873U | 2012-12-12 | |||
| US20180295449A1 | 2018-10-11 |
Attorney, Agent or Firm:
BEYOND TALENT PATENT AGENT FIRM (CN)
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