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Patent Searching and Data


Title:
VIBRATION CUTTING PROCESS DIAGNOSTIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/059729
Kind Code:
A1
Abstract:
The purpose of the present invention is to obtain a vibration cutting process diagnostic device such that, when performing a vibration cutting process for processing the cross sectional shape of an object to be processed into a non-perfect circular shape by reciprocating a tool, whether the process can be performed under a speed condition designating a vibration cutting can be diagnosed prior to the process. A vibration cutting process diagnostic device that makes a diagnosis as to whether a vibration cutting process for processing the cross sectional shape of an object to be processed into a non-perfect circular shape can be performed by a reciprocating motion of a movable axis is provided with: a frequency analysis unit (4) that computes, on the basis of shape data (1) which are processing shape data of a work as the object to be processed and a processing speed set value (2), a frequency component included in a movable axis position command signal; and a processing diagnosis implementation unit (5) that makes a diagnosis as to the possibility of processing the shape data (1) with the processing speed set value (2), on the basis of the frequency component and a movable axis parameter (3) of the movable axis.

Inventors:
NAGAOKA KOTARO (JP)
TANABE AKIRA (JP)
AZUMA TOSHIHIRO (JP)
Application Number:
JP2014/077748
Publication Date:
April 21, 2016
Filing Date:
October 17, 2014
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
G05B19/406; B23B1/00; B23B5/24
Foreign References:
JPH02205439A1990-08-15
JPH0236045A1990-02-06
JPH03178703A1991-08-02
JPH01271102A1989-10-30
Attorney, Agent or Firm:
SAKAI, HIROAKI (JP)
Hiroaki Sakai (JP)
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