Title:
VIBRATION SENSOR, AUDIO APPARATUS, AND METHOD FOR ASSEMBLING VIBRATION SENSOR
Document Type and Number:
WIPO Patent Application WO/2020/258172
Kind Code:
A1
Abstract:
Provided are a vibration sensor, an audio apparatus, and a method for assembling a vibration sensor. The vibration sensor comprises a cavity having an inner wall, a spacer provided within the cavity, an elastic film, and a MEMS chip having a rear cavity. The spacer is provided on the inner wall. The elastic film is provided on a side surface of the spacer away from the inner wall. The MEMS chip is provided on a side surface of the elastic film away from the spacer. A side surface of the spacer facing the elastic film is provided with a recess. The elastic film covers the recess and is provided with a through hole therein. The vibration sensor of the present invention reduces product height and enhances sensitivity in picking up vibration signals.
Inventors:
ZHANG JINYU (CN)
Application Number:
PCT/CN2019/093335
Publication Date:
December 30, 2020
Filing Date:
June 27, 2019
Export Citation:
Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
International Classes:
H04R19/04; H04R19/01
Foreign References:
| CN109451384A | 2019-03-08 | |||
| CN106851509A | 2017-06-13 | |||
| CN208739421U | 2019-04-12 | |||
| US20180352342A1 | 2018-12-06 |
Attorney, Agent or Firm:
GUANGZHOU YUEXIU JILY PATENT & TRADEMARK LAW OFFICE (CN)
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