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Patent Searching and Data


Title:
VIBRATION SENSOR
Document Type and Number:
WIPO Patent Application WO/2018/096896
Kind Code:
A1
Abstract:
A vibration sensor according to the present invention is provided with: a substrate having a recessed section in a top surface thereof; a conductive plate provided in the recessed section; a frame-shaped conductive member that is provided on the substrate and that surrounds the periphery of the conductive plate; a spherical conductive member that is provided on the substrate and that is in contact with the conductive plate in a region surrounded by the frame-shaped conductive member; a frame body that is provided on the substrate and that surrounds the frame-shaped conductive member; a first metallized layer that is provided on the substrate and that is connected to the frame-shaped conductive member; and a lid body that is provided on the frame body and that covers the spherical conductive member. A first peripheral edge of the first metallized layer, the first peripheral edge being on the opposite side from the recessed section, is disposed between the substrate and the frame body.

Inventors:
MATSUURA, Shingo (6 Takeda Tobadono-cho, Fushimi-ku, Kyoto-sh, Kyoto 01, 〒6128501, JP)
KANCHIKU, Tsuyoshi (6 Takeda Tobadono-cho, Fushimi-ku, Kyoto-sh, Kyoto 01, 〒6128501, JP)
Application Number:
JP2017/039598
Publication Date:
May 31, 2018
Filing Date:
November 01, 2017
Export Citation:
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Assignee:
KYOCERA CORPORATION (6 Takeda Tobadono-cho, Fushimi-ku Kyoto-sh, Kyoto 01, 〒6128501, JP)
International Classes:
H01H35/14; G01H1/00
Domestic Patent References:
WO2007021039A12007-02-22
Foreign References:
JP2015087220A2015-05-07
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