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Patent Searching and Data


Title:
VIBRATION SENSOR
Document Type and Number:
WIPO Patent Application WO/2018/154936
Kind Code:
A1
Abstract:
This vibration sensor is provided with: a substrate having a recessed section in the upper surface; a conductive plate, which is positioned in the recessed section, and which has an upper surface that is bent in a convex shape; a frame-shaped conductive member, which is positioned on the substrate, and which surrounds the periphery of the recessed section; a spherical conductive member, which is positioned on the substrate, and is, in a region surrounded by the frame-shaped conductive member, in contact with the conductive plate; a frame body, which is positioned on the substrate, and which surrounds the frame-shaped conductive member; a metallization layer, which is positioned on the substrate, and which surrounds the recessed section, said metallization layer being connected to the frame-shaped conductive member; and a cover body which is positioned on the frame body, and which covers the spherical conductive member.

Inventors:
NAKAMOTO, Shinji (6 Takeda Tobadono-cho, Fushimi-ku, Kyoto-sh, Kyoto 01, 〒6128501, JP)
SAKUMOTO, Daisuke (6 Takeda Tobadono-cho, Fushimi-ku, Kyoto-sh, Kyoto 01, 〒6128501, JP)
Application Number:
JP2017/045335
Publication Date:
August 30, 2018
Filing Date:
December 18, 2017
Export Citation:
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Assignee:
KYOCERA CORPORATION (6 Takeda Tobadono-cho, Fushimi-ku Kyoto-sh, Kyoto 01, 〒6128501, JP)
International Classes:
H01H35/14
Foreign References:
JP2015087220A2015-05-07
JPS6364229A1988-03-22
JPH1164087A1999-03-05
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