Title:
VISCOSITY REDUCIBLE RADIATION CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO2005007759
Kind Code:
A3
Abstract:
The invention relates to a viscosity reducible radiation curable composition comprising at least one radiation curable component and a filler, wherein the composition has the properties i) a yield stress value of < 1100 Pa, ii) a viscosity (at a shear rate of 1 sec between 1 and 1500 Pa.sec, and iii) a filler settling speed less than 0.3 mm/day.
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Inventors:
YOU XIAORONG (US)
Application Number:
PCT/NL2004/000517
Publication Date:
March 03, 2005
Filing Date:
July 16, 2004
Export Citation:
Assignee:
DSM IP ASSETS BV (NL)
YOU XIAORONG (US)
YOU XIAORONG (US)
International Classes:
B29C41/00; C08L51/08; C09D7/45; C09D151/08; G03F7/00; G03F7/004; G03F7/038; B29C67/00; (IPC1-7): B29C67/00; B29C41/12; C09D7/02; C09D7/12; G03F7/00
Foreign References:
EP0499485A2 | 1992-08-19 | |||
US6099787A | 2000-08-08 | |||
US20020195746A1 | 2002-12-26 |
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