VISIBLE LIGHT CURING ADHESIVE AND PREPARATION METHOD THEREOF

WIPO Patent Application WO/2019/218702

A1

Provided is a visible light curing adhesive and a preparation method thereof. The visible light curing adhesive comprises: N parts by weight of a polymerizable fluorine-containing epoxy resin (0 ≤ N ≤ 100), 100-N parts by weight of a diluent monomer, 0.01-5 parts by weight of a light absorber, 0.01-5 parts by weight of a photoinitiator, 1-10 parts by weight of a short fiber, 0.1 to 5 parts by weight of a surfactant, 0.1 to 5 parts by weight of a coupling agent, 1 to 10 parts by weight of an adhesion enhancer, and 0.1 to 0.5 part by weight of a polymerization inhibitor. According to the method, the visible light curing adhesive can better infiltrate into the substrate to be bonded by adding the polymerizable fluorine-containing epoxy resin, and the mechanical strength can be effectively increased and the curing shrinkage can be reduced by adding the short fiber. Compared with the traditional light curing adhesive, the visible light curing adhesive has the advantages of low surface tension, fast curing speed, small shrinkage, strong bonding force, simple preparation method and being suitable for deep curing, and can be widely used in advanced manufacturing, optical device bonding and electronic packaging.

CUI KEJIAN (CN)

PCT/CN2019/070537

November 21, 2019

January 05, 2019

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YLX INC (CN)

C09J163/00; C09J127/00; C09J127/12; C09J163/02

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