Title:
VOID BEHAVIOR ANALYSIS METHOD AND APPARATUS THEREFOR
Document Type and Number:
WIPO Patent Application WO/2016/199211
Kind Code:
A1
Abstract:
A void behavior analysis method for analyzing, by means of a computer, the behavior of a void generated in the process of molding a liquid material injected into a space inside a mold comprises: an input step of inputting or generating a shape corresponding to a filling part of a product to be analyzed, a physical property value of a filling material, and an initial condition of a void particle, assuming the existence of a void; and a calculation step of calculating an amount of movement of the void particle at prescribed time intervalf, using data from the input step. In the calculation step, a determination is made as to whether the void particle is in contact with a wall surface, for each time step. If it is determined that the void particle is in contact with a wall surface, a resistance coefficient of the void is calculated as a function including the movement speed of the void, the diameter of the void, the viscosity of a resin material, and the angle of inclination of the wall surface.
Inventors:
SHIMADA RYOTARO (JP)
KONO TSUTOMU (JP)
MINO MASAYUKI (JP)
KONO TSUTOMU (JP)
MINO MASAYUKI (JP)
Application Number:
PCT/JP2015/066535
Publication Date:
December 15, 2016
Filing Date:
June 09, 2015
Export Citation:
Assignee:
HITACHI LTD (JP)
International Classes:
B29C45/76; B29C45/17; B29C45/26; G01N11/00; G06F17/50
Domestic Patent References:
| WO2015072040A1 | 2015-05-21 |
Foreign References:
| JPH05337999A | 1993-12-21 | |||
| JP2010108150A | 2010-05-13 | |||
| JP2013248770A | 2013-12-12 | |||
| JP2011103089A | 2011-05-26 | |||
| JP2012081703A | 2012-04-26 | |||
| JP2014211363A | 2014-11-13 |
Other References:
MASAYUKI MINO ET AL.: "Study on Prediction about Residual Position of Void Generated by Resin Flow", ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2014 IEEE 64TH, 30 May 2014 (2014-05-30), pages 2042 - 2047, XP032641920
Attorney, Agent or Firm:
SEIRYO I. P. C. (JP)
青稜 patent business corporation (JP)
青稜 patent business corporation (JP)
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