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Title:
VOID-CONTAINING HEAT-SHRINKABLE POLYESTER-BASED FILM
Document Type and Number:
WIPO Patent Application WO/2017/170495
Kind Code:
A1
Abstract:
[Problem] To provide a void-containing heat-shrinkable polyester-based film which, even when produced at a heightened efficiency, can have satisfactory shrink finishing and printability. [Solution] A void-containing heat-shrinkable polyester-based film that has a multilayer structure comprising a foamed layer and non-foamed layers disposed as outside layers respectively on both sides of the foamed layer, wherein the two outside films are equal in thickness, density, and the number of moles of an amorphous component. Due to this, the polyester-based film has specific heat shrinkability and a specific gloss.

Inventors:
HARUTA, Masayuki (LTD. 10-24 Toyo-cho, Tsuruga-sh, Fukui 50, 〒9148550, JP)
TABOTA, Norimi (LTD. 2-8 Dojima Hama 2-chome, Kita-k, Osaka-shi Osaka 30, 〒5308230, JP)
Application Number:
JP2017/012552
Publication Date:
October 05, 2017
Filing Date:
March 28, 2017
Export Citation:
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Assignee:
TOYOBO CO., LTD. (2-8 Dojima Hama 2-chome, Kita-ku Osaka-sh, Osaka 30, 〒5308230, JP)
International Classes:
B29C61/06; B29C55/06; B32B27/36; B65D23/08; C08J9/00; B29K67/00; B29K105/04; B29L7/00; B29L9/00
Domestic Patent References:
WO2010143737A12010-12-16
Foreign References:
JP2010047006A2010-03-04
JP2005112906A2005-04-28
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