VOID-CONTAINING HEAT-SHRINKABLE POLYESTER-BASED FILM

Title:

VOID-CONTAINING HEAT-SHRINKABLE POLYESTER-BASED FILM

Document Type and Number:

WIPO Patent Application WO/2017/170495

Kind Code:

A1

Abstract:

[Problem] To provide a void-containing heat-shrinkable polyester-based film which, even when produced at a heightened efficiency, can have satisfactory shrink finishing and printability. [Solution] A void-containing heat-shrinkable polyester-based film that has a multilayer structure comprising a foamed layer and non-foamed layers disposed as outside layers respectively on both sides of the foamed layer, wherein the two outside films are equal in thickness, density, and the number of moles of an amorphous component. Due to this, the polyester-based film has specific heat shrinkability and a specific gloss.

Inventors:

HARUTA MASAYUKI (JP)
TABOTA NORIMI (JP)

Application Number:

PCT/JP2017/012552

Publication Date:

October 05, 2017

Filing Date:

March 28, 2017

Export Citation:

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Assignee:

TOYO BOSEKI (JP)

International Classes:

B29C61/06; B29C55/06; B32B27/36; B65D23/08; C08J9/00; B29K67/00; B29K105/04; B29L7/00; B29L9/00

Domestic Patent References:

WO2010143737A1

2010-12-16

Foreign References:

JP2010047006A	2010-03-04
JP2005112906A	2005-04-28

Other References: