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Patent Searching and Data


Title:
VOLATILE COPPER(II) COMPLEXES FOR DEPOSITION OF COPPER FILMS BY ATOMIC LAYER DEPOSITION
Document Type and Number:
WIPO Patent Application WO2003095701
Kind Code:
A8
Abstract:
The present invention relates to novel 1,3-diimine copper complexes and the use of 1,3-diimine copper complexes for the deposition of copper on substrates or in or on porous solids in an Atomic Layer Deposition process. This invention also provides a process for making amino-imines and novel amino-imines.

Inventors:
BRADLEY ALEXANDER ZAK (US)
THORN DAVID LINCOLN (US)
THOMPSON JEFFERY SCOTT (US)
Application Number:
US0301846W
Publication Date:
May 21, 2004
Filing Date:
January 21, 2003
Export Citation:
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Assignee:
E.I. DU PONT DE NEMOURS AND COMPANY
BRADLEY, ALEXANDER, ZAK
THORN, DAVID, LINCOLN
THOMPSON, JEFFERY, SCOTT
International Classes:
C07C249/02; C07C251/12; C07C251/16; C07D213/74; C07F1/08; C23C16/18; H01L21/285; (IPC1-7): C23C16/18; C07F1/08; C07C249/02; C07C249/16; C07C251/78; C07C251/16; C07C251/12
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