Title:
WAFER BONDED BACK ILLUMINATED IMAGER
Document Type and Number:
WIPO Patent Application WO/2019/004276
Kind Code:
A1
Abstract:
An imaging device includes a first substrate including a pixel array and a first multilayer wiring layer. The first multilayer wiring layer includes a first wiring that receives electrical signals based on electric charge generated by at least one photoelectric conversion unit, and a plurality of second wirings. The imaging device includes a second substrate including a second multilayer wiring layer and a logic circuit that processes the electrical signals. The second multilayer wiring layer includes a third wiring bonded to the first wiring, and a plurality of fourth wirings. At least one of the plurality of fourth wirings being bonded to at least one of the plurality of second wirings. The second multilayer wiring layer includes at least one fifth wiring that is connected to the plurality of fourth wirings and that receives a power supply signal.
Inventors:
YAMAGISHI HAJIME (JP)
Application Number:
PCT/JP2018/024341
Publication Date:
January 03, 2019
Filing Date:
June 27, 2018
Export Citation:
Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORP (JP)
International Classes:
H01L27/146
Foreign References:
| US20120199930A1 | 2012-08-09 | |||
| US20170180668A1 | 2017-06-22 | |||
| JP2012064709A | 2012-03-29 | |||
| JP2013073988A | 2013-04-22 | |||
| JP2012164870A | 2012-08-30 |
Attorney, Agent or Firm:
MARUSHIMA, Toshikazu (JP)
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