Title:
WAFER BONDING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2010/058481
Kind Code:
A1
Abstract:
A wafer bonding apparatus is provided with a first sample table for holding a first substrate; a second sample table for holding a second substrate facing the first substrate; a load transmitting section, which is bonded to the periphery of the first sample table and supports the first sample table to a first stage; and a driving apparatus which bonds the first substrate and the second substrate with pressure by driving the second sample table to the first stage. The wafer bonding apparatus prevents a load larger than a load applied to the periphery of the first substrate from being applied to the center of the first substrate at the time of bonding the first substrate and the second substrate with pressure, and the load is uniformly applied to the first substrate and the second substrate.
Inventors:
TAWARA, Satoshi (717-1, Fukahori-machi 5-chome, Nagasaki-sh, Nagasaki 92, 85103, JP)
Application Number:
JP2008/071232
Publication Date:
May 27, 2010
Filing Date:
November 21, 2008
Export Citation:
Assignee:
MITSUBISHI HEAVY INDUSTRIES, LTD. (16-5, Konan 2-Chome Minato-ku Tokyo, 15, 10882, JP)
三菱重工業株式会社 (〒15 東京都港区港南二丁目１６番５号 Tokyo, 10882, JP)
三菱重工業株式会社 (〒15 東京都港区港南二丁目１６番５号 Tokyo, 10882, JP)
International Classes:
B23K20/02; B23K20/00; B30B15/02; H01L21/02
Attorney, Agent or Firm:
KUDOH, Minoru (6F KADOYA BLDG, 24-10 Minamiooi 6-chom, Shinagawa-ku Tokyo 13, 14000, JP)